参数资料
| 型号： | XCV300E-6FG456C |
| 厂商： | Xilinx Inc |
| 文件页数： | 212/233页 |
| 文件大小： | 0K |
| 描述： | IC FPGA 1.8V C-TEMP 456-FBGA |
| 产品变化通告： | FPGA Family Discontinuation 18/Apr/2011 |
| 标准包装： | 60 |
| 系列： | Virtex®-E |
| LAB/CLB数： | 1536 |
| 逻辑元件/单元数： | 6912 |
| RAM 位总计： | 131072 |
| 输入/输出数： | 312 |
| 门数： | 411955 |
| 电源电压： | 1.71 V ~ 1.89 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 456-BBGA |
| 供应商设备封装： | 456-FBGA |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页第126页第127页第128页第129页第130页第131页第132页第133页第134页第135页第136页第137页第138页第139页第140页第141页第142页第143页第144页第145页第146页第147页第148页第149页第150页第151页第152页第153页第154页第155页第156页第157页第158页第159页第160页第161页第162页第163页第164页第165页第166页第167页第168页第169页第170页第171页第172页第173页第174页第175页第176页第177页第178页第179页第180页第181页第182页第183页第184页第185页第186页第187页第188页第189页第190页第191页第192页第193页第194页第195页第196页第197页第198页第199页第200页第201页第202页第203页第204页第205页第206页第207页第208页第209页第210页第211页当前第212页第213页第214页第215页第216页第217页第218页第219页第220页第221页第222页第223页第224页第225页第226页第227页第228页第229页第230页第231页第232页第233页
Virtex-E 1.8 V Field Programmable Gate Arrays
R
Module 2 of 4
DS022-2 (v3.0) March 21, 2014
2
Production Product Specification
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
In addition to the CLK and CE control signals, the three
flip-flops share a Set/Reset (SR). For each flip-flop, this sig-
nal can be independently configured as a synchronous Set,
a synchronous Reset, an asynchronous Preset, or an asyn-
chronous Clear.
The output buffer and all of the IOB control signals have
independent polarity controls.
All pads are protected against damage from electrostatic
discharge (ESD) and from over-voltage transients. After
configuration, clamping diodes are connected to VCCO with
the exception of LVCMOS18, LVCMOS25, GTL, GTL+,
LVDS, and LVPECL.
Optional pull-up, pull-down and weak-keeper circuits are
attached to each pad. Prior to configuration all outputs not
involved in configuration are forced into their high-imped-
ance state. The pull-down resistors and the weak-keeper
circuits are inactive, but I/Os can optionally be pulled up.
The activation of pull-up resistors prior to configuration is
controlled on a global basis by the configuration mode pins.
If the pull-up resistors are not activated, all the pins are in a
high-impedance state. Consequently, external pull-up or
pull-down resistors must be provided on pins required to be
at a well-defined logic level prior to configuration.
All Virtex-E IOBs support IEEE 1149.1-compatible Bound-
ary Scan testing.
Input Path
The Virtex-E IOB input path routes the input signal directly
to internal logic and/ or through an optional input flip-flop.
An optional delay element at the D-input of this flip-flop elim-
inates pad-to-pad hold time. The delay is matched to the
internal clock-distribution delay of the FPGA, and when
used, assures that the pad-to-pad hold time is zero.
Each input buffer can be configured to conform to any of the
low-voltage signalling standards supported. In some of
these standards the input buffer utilizes a user-supplied
threshold voltage, VREF. The need to supply VREF imposes
constraints on which standards can be used in close prox-
imity to each other. See I/O Banking.
There are optional pull-up and pull-down resistors at each
user I/O input for use after configuration. Their value is in
the range 50 – 100 k
Ω.
Output Path
The output path includes a 3-state output buffer that drives
the output signal onto the pad. The output signal can be
routed to the buffer directly from the internal logic or through
an optional IOB output flip-flop.
The 3-state control of the output can also be routed directly
from the internal logic or through a flip-flip that provides syn-
chronous enable and disable.
Each output driver can be individually programmed for a
wide range of low-voltage signalling standards. Each output
buffer can source up to 24 mA and sink up to 48 mA. Drive
strength and slew rate controls minimize bus transients.
In most signalling standards, the output High voltage
depends on an externally supplied VCCO voltage. The need
to supply VCCO imposes constraints on which standards
can be used in close proximity to each other. See I/O Bank-
An optional weak-keeper circuit is connected to each out-
put. When selected, the circuit monitors the voltage on the
pad and weakly drives the pin High or Low to match the
input signal. If the pin is connected to a multiple-source sig-
nal, the weak keeper holds the signal in its last state if all
drivers are disabled. Maintaining a valid logic level in this
way eliminates bus chatter.
Since the weak-keeper circuit uses the IOB input buffer to
monitor the input level, an appropriate VREF voltage must be
provided if the signalling standard requires one. The provi-
sion of this voltage must comply with the I/O banking rules.
I/O Banking
Some of the I/O standards described above require VCCO
and/or VREF voltages. These voltages are externally sup-
plied and connected to device pins that serve groups of
IOBs, called banks. Consequently, restrictions exist about
which I/O standards can be combined within a given bank.
Table 1: Supported I/O Standards
I/O
Standard
Output
VCCO
Input
VCCO
Input
VREF
Board
Termination
Voltage (VTT)
LVTTL
3.3
N/A
LVCMOS2
2.5
N/A
LVCMOS18
1.8
N/A
SSTL3 I & II
3.3
N/A
1.50
SSTL2 I & II
2.5
N/A
1.25
GTL
N/A
0.80
1.20
GTL+
N/A
1.0
1.50
HSTL I
1.5
N/A
0.75
HSTL III & IV
1.5
N/A
0.90
1.50
CTT
3.3
N/A
1.50
AGP-2X
3.3
N/A
1.32
N/A
PCI33_3
3.3
N/A
PCI66_3
3.3
N/A
BLVDS & LVDS
2.5
N/A
LVPECL
3.3
N/A
相关PDF资料 |
PDF描述 |
|---|---|
| SST39VF800A-70-4C-B3KE-T | IC FLASH MPF 8MBIT 70NS 48TFBGA |
| 25LC512-E/SN | IC EEPROM 512KBIT 20MHZ 8SOIC |
| 25LC512T-E/SN | IC EEPROM 512KBIT 20MHZ 8SOIC |
| SST25VF032B-66-4I-S2AF-T | IC FLASH SER 32M 66MHZ SPI 8SOIC |
| SST25VF032B-80-4I-S2AF-T | IC FLSH SER 32MB 66MHZ SPI 8SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XCV300E-6FG456C0707 | 制造商:Xilinx 功能描述: |
| XCV300E-6FG456I | 功能描述:IC FPGA 1.8V I-TEMP 456-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex®-E 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XCV300E-6HQ204C | 制造商:XILINX 制造商全称:XILINX 功能描述:Virte -E 1.8 V Field Programmable Gate Arrays |
| XCV300E-6HQ204I | 制造商:XILINX 制造商全称:XILINX 功能描述:Virte -E 1.8 V Field Programmable Gate Arrays |
| XCV300E-6HQ240C | 制造商:XILINX 制造商全称:XILINX 功能描述:Virtex-E 1.8 V Field Programmable Gate Arrays |
发布紧急采购，3分钟左右您将得到回复。