参数资料
型号: AD9852ASVZ
厂商: Analog Devices Inc
文件页数: 35/52页
文件大小: 0K
描述: IC DDS SYNTHESIZER CMOS 80-TQFP
产品培训模块: Direct Digital Synthesis Tutorial Series (1 of 7): Introduction
Direct Digital Synthesizer Tutorial Series (7 of 7): DDS in Action
Direct Digital Synthesis Tutorial Series (3 of 7): Angle to Amplitude Converter
Direct Digital Synthesis Tutorial Series (6 of 7): SINC Envelope Correction
Direct Digital Synthesis Tutorial Series (4 of 7): Digital-to-Analog Converter
Direct Digital Synthesis Tutorial Series (2 of 7): The Accumulator
标准包装: 1
分辨率(位): 12 b
主 fclk: 300MHz
调节字宽(位): 48 b
电源电压: 3.14 V ~ 3.47 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 80-TQFP 裸露焊盘
供应商设备封装: 80-TQFP-EP(12x12)
包装: 托盘
配用: AD9852/PCBZ-ND - BOARD EVAL FOR AD9852
AD9852
Rev. E | Page 40 of 52
EVALUATION OF OPERATING CONDITIONS
The first step in applying the AD9852 is to select the internal
clock frequency. Clock frequency selections greater than 200 MHz
require use of the thermally enhanced package (AD9852ASVZ);
clock frequency selections equal to or less than 200 MHz may
allow use of the standard (nonthermally enhanced) plastic
surface-mount package, but more information is needed to
make this determination.
The second step is to determine the maximum required
operating temperature for the AD9852 in a given application.
Subtract this value from 150°C, which is the maximum junction
temperature allowed for the AD9852. For the extended indust-
rial temperature range, the maximum operating temperature is
85°C, which results in a difference of 65°C. This is the maxi-
mum temperature gradient the device can experience due to
power dissipation.
The third step is to divide this maximum temperature gradient
by the thermal impedance to determine the maximum power
dissipation allowed for the application. For this example, 65°C
divided by the thermal impedance of the package yields a total
power dissipation limit of 4.1 W and 1.7 W for the thermally and
nonthermally enhanced packages, respectively. Therefore, for a
3.3 V nominal power supply voltage, the current consumed by the
device under full operating conditions must not exceed 515 mA
for the standard plastic package or 1242 mA for the thermally
enhanced package. The total set of enabled functions and
operating conditions for a given application must support these
current consumption limits.
Figure 59 and Figure 60 can be used to determine the suitability
of a given AD9852 application in terms of the power dissipation
requirements. These graphs assume that the AD9852 device is
soldered to a multilayer PCB according to the recommended best
manufacturing practices and procedures for a given package type.
This ensures that the specified thermal impedance specifications
are achieved.
THERMALLY ENHANCED PACKAGE
MOUNTING GUIDELINES
Refer to the AN-772 Application Note for details on mounting
devices with an exposed paddle.
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相关代理商/技术参数
参数描述
AD9852ASVZ 制造商:Analog Devices 功能描述:IC DDS 300MHz TQFP-80 制造商:Analog Devices 功能描述:IC, DDS, 300MHz, TQFP-80
AD9852ASVZ1 制造商:AD 制造商全称:Analog Devices 功能描述:CMOS 300 MSPS Complete DDS
AD9852BSVZ 制造商:Analog Devices 功能描述:
AD9853 制造商:AD 制造商全称:Analog Devices 功能描述:Programmable Digital OPSK/16-QAM Modulator
AD9853-45PCB 制造商:AD 制造商全称:Analog Devices 功能描述:Programmable Digital OPSK/16-QAM Modulator