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参数资料
| 型号： | ADAU1445YSVZ-3A-RL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 84/92页 |
| 文件大小： | 0K |
| 描述： | IC SIGMADSP 175MHZ 100TQFP |
| 标准包装： | 1,000 |
| 系列： | SigmaDSP® |
| 类型： | 音频处理器 |
| 应用： | 车载音频 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 100-TQFP 裸露焊盘 |
| 供应商设备封装： | 100-TQFP-EP（14x14） |
| 包装： | 带卷 (TR) |
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ADAU1445/ADAU1446
Rev. A | Page 85 of 92
APPLICATIONS INFORMATION
07
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LAYOUT RECOMMENDATIONS
Parts Placement
All 100 nF bypass capacitors, which are recommended for every
analog, digital, and PLL power-ground pair, should be placed as
close to the ADAU1445/ADAU1446 as possible. The AVDD,
DVDD, PVDD, and IOVDD supply signals on the board should
each be bypassed with an additional single bulk capacitor (10 μF
to 47 μF).
All traces in the crystal oscillator circuit (Figure 9) should be
kept as short as possible to minimize stray capacitance. There
should not be any long board traces connected to crystal
oscillator circuit components because such traces may affect
crystal startup and operation.
Figure 61. Exposed Pad Layout Example—Top View
PLL Loop Filter
The single resistor and two capacitors in the PLL loop filter
should be connected to the PLL_FILT and PVDD pins with
short traces to minimize jitter.
Grounding
Power Supply Bypass Capacitors
A single ground plane should be used in the application layout.
Components in an analog signal path should be placed away
from digital signals.
Each power supply pin should be bypassed to its nearest
appropriate ground pin with a single 100 nF capacitor. The
connections to each side of the capacitor should be as short as
possible, and the trace should stay on a single layer with no vias.
For maximum effectiveness, the capacitor should preferably be
located either equidistant from the power and ground pins or,
when equidistant placement is not possible, slightly closer to the
power pin. Thermal connections to the planes should be made
on the far side of the capacitor.
Exposed Pad PCB Design
The ADAU1445 package includes an exposed pad for improved
heat dissipation. When designing a board for such a package,
special consideration should be given to the following:
A copper layer equal in size to the exposed pad should be
on all layers of the board, from top to bottom, and should
connect somewhere to a dedicated copper board layer (see
POWER GROUND
TO GROUND
TO POWER
CAPACITOR
07
69
6-
0
61
Vias should be placed to connect all layers of copper, allowing
for efficient heat and energy conductivity. For an example,
see Figure 61, which has 16 vias arranged in a 4 × 4 grid in
the pad area.
0
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6-
0
67
TOP
POWER
GROUND
BOTTOM
COPPER SQUARES
VIAS
Figure 62. Recommended Power Supply Bypass Capacitor Layout
Figure 60. Exposed Pad Layout Example—Side View
EOS/ESD Protection
Although the ADAU1445/ADAU1446 have robust internal
protection circuitry against overvoltages and electrostatic
discharge, an external transient voltage suppressor (TVS) is
recommended for all systems to prevent damage to the IC.
Examples can be found in the AN-311 Application Note on the
Analog Devices website.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADAU1446EBZ | 制造商:Analog Devices 功能描述:SIGMADSP? DIGITAL AUDIO PROCESSOR WITH FLEXIBLE AUDIO - Bulk |
| ADAU1446YSTZ-3A | 功能描述:IC SIGMADSP 175MHZ 100LQFP RoHS:是 类别:集成电路 (IC) >> 线性 - 音频处理 系列:SigmaDSP® 其它有关文件:STA321 View All Specifications 标准包装:1 系列:Sound Terminal™ 类型:音频处理器 应用:数字音频 安装类型:表面贴装 封装/外壳:64-LQFP 裸露焊盘 供应商设备封装:64-LQFP EP（10x10） 包装:Digi-Reel® 其它名称:497-11050-6 |
| ADAU1446YSTZ-3A-RL | 功能描述:IC SIGMADSP 175MHZ 100LQFP RoHS:是 类别:集成电路 (IC) >> 线性 - 音频处理 系列:SigmaDSP® 其它有关文件:STA321 View All Specifications 标准包装:1 系列:Sound Terminal™ 类型:音频处理器 应用:数字音频 安装类型:表面贴装 封装/外壳:64-LQFP 裸露焊盘 供应商设备封装:64-LQFP EP（10x10） 包装:Digi-Reel® 其它名称:497-11050-6 |
| ADAU1450WBCPZ | 功能描述:IC AUDIO PROCESSOR 72LFCSP 制造商:analog devices inc. 系列:SigmaDSP? 包装:托盘 零件状态:有效 类型:Sigma 接口:I2C，SPI 时钟速率:147.456MHz 非易失性存储器:- 片载 RAM:64KB 电压 - I/O:3.3V 电压 - 内核:1.20V 工作温度:-40°C ~ 105°C（TA） 安装类型:表面贴装 封装/外壳:72-VFQFN 裸露焊盘，CSP 供应商器件封装:72-LFCSP-VQ（10x10） 标准包装:1 |
| ADAU1450WBCPZ-RL | 功能描述:IC AUDIO PROCESSOR 72LFCSP 制造商:analog devices inc. 系列:SigmaDSP? 包装:剪切带（CT） 零件状态:在售 类型:Sigma 接口:I2C，SPI 时钟速率:147.456MHz 非易失性存储器:- 片载 RAM:64KB 电压 - I/O:3.30V 电压 - 内核:1.20V 工作温度:-40°C ~ 105°C（TA） 安装类型:表面贴装 封装/外壳:72-VFQFN 裸露焊盘，CSP 供应商器件封装:72-LFCSP-VQ（10x10） 标准包装:1 |
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