参数资料
型号: DSPB56364AF100
厂商: Freescale Semiconductor
文件页数: 59/148页
文件大小: 0K
描述: IC DSP 24BIT AUD 100MHZ 100-LQFP
标准包装: 90
系列: DSP56K/Symphony
类型: 音频处理器
接口: 主机接口,I²C,SAI,SPI
时钟速率: 100MHz
非易失内存: ROM(24 kB)
芯片上RAM: 11.25kB
电压 - 输入/输出: 3.30V
电压 - 核心: 3.30V
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 100-LQFP
供应商设备封装: 100-LQFP(14x14)
包装: 托盘
Thermal Characteristics
DSP56364 Technical Data, Rev. 4.1
3-2
Freescale Semiconductor
3.3
Thermal Characteristics
Table 3-1 Maximum Ratings
Rating1
1 GND = 0 V, V
CC = 3.3 V ± 0.16 V, TJ = –0°C to +105°C, CL = 50 pF
Symbol
Value1, 2
2 Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond
the maximum rating may affect device reliability or cause permanent damage to the device.
Unit
Supply Voltage
VCC
0.3 to +4.0
V
All input voltages excluding “5 V tolerant” inputs3
3 CAUTION: All “5 V Tolerant” input voltages must not be more than 3.95 V greater than the supply voltage; this restriction
applies to “power on”, as well as during normal operation. In any case, the input voltages cannot be more than 5.75 V. “5 V
Tolerant” inputs are inputs that tolerate 5 V.
VIN
GND -0.3 to VCC + 0.3
V
All “5 V tolerant” input voltages3
VIN5
GND
0.3 to V
CC + 3.95
V
Current drain per pin excluding VCC and GND
I
10
mA
Operating temperature range
TJ
-40 to +105
°C
Storage temperature
TSTG
55 to +125
°C
Table 3-2 Thermal Characteristics
Characteristic
Symbol
TQFP Value
Unit
Junction-to-ambient thermal resistance1
1 Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided printed circuit board per SEMI
G38-87 in natural convection. (SEMI is Semiconductor Equipment and Materials International, 805 East Middlefield Rd.,
Mountain View, CA 94043, (415) 964-5111.)
Measurements were done with parts mounted on thermal test boards conforming to specification EIA/JESD51-3.
RθJA or θJA
49.87
°C/W
Junction-to-case thermal resistance2
2 Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88, with the exception that
the cold plate temperature is used for the case temperature.
RθJC or θJC
9.26
°C/W
Thermal characterization parameter
Ψ
JT
2.0
°C/W
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