参数资料
型号: ISL6267HRZ
厂商: Intersil
文件页数: 9/33页
文件大小: 0K
描述: IC PWM CTRLR MULTIPHASE 48TQFN
标准包装: 50
系列: Robust Ripple Regulator™ (R³)
应用: 控制器,AMD Fusion? CPU GPU
输入电压: 4.5 V ~ 25 V
输出数: 2
输出电压: 0.013 V ~ 1.55 V
工作温度: -10°C ~ 100°C
安装类型: 表面贴装
封装/外壳: 48-VFQFN 裸露焊盘
供应商设备封装: 48-QFN(6x6)
包装: 管件
ISL6267
Pin Descriptions (Continued)
PIN NUMBER
40
41
42
43
44
45
46
47
48
SYMBOL
BOOT1_NB
PROG2
NTC_NB
ISUMN_NB
ISUMP_NB
RTN_NB
VSEN_NB
ISEN2_NB
ISEN1_NB
GND (Bottom Pad)
DESCRIPTION
Connect an MLCC capacitor across the BOOT1_NB and the PH1_NB pins. The boot capacitor is charged
through an internal boot diode connected from the VCCP pin to the BOOT1_NB pin, each time the
PH1_NB pin drops below VCCP minus the voltage dropped across the internal boot diode.
Program pin for setting output voltage offset for Northbridge VR.
Thermistor input to VR_HOT circuit to monitor Northbridge VR temperature.
Inverting input of the transconductance amplifier for current monitor and load line of the Northbridge VR.
Non-inverting input of the transconductance amplifier for current monitor and load line of the
Northbridge VR.
Output voltage sense return pin for the Northbridge controller. Connect to the -sense pin of the
microprocessor die.
Output voltage sense pin for the Northbridge controller. Connect to the +sense pin of the microprocessor
die.
Individual current sensing for Channel 2 of the Northbridge VR. When ISEN2 is pulled to 5V VDD, the
controller will disable Channel 2 and the Northbridge VR will run single-phase.
Individual current sensing for Channel 1 of the Northbridge VR.
Signal common of the IC. Unless otherwise stated, signals are referenced to the GND pin.
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
ISL6267HRZ
ISL6267IRZ
PART
MARKING
ISL6267 HRZ
ISL6267 IRZ
TEMP.
RANGE (°C)
-10 to +100
-40 to +100
PACKAGE
(Pb-free)
48 Ld 6x6 QFN
48 Ld 6x6 QFN
PKG.
DWG. #
L48.6x6B
L48.6x6B
ISL6267EVAL1Z
Evaluation Board
NOTES:
1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL6267 . For more information on MSL please see tech brief TB363 .
9
January 8, 2013
FN7801.1
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