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| 型号： | MPC603RVG200LC |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 16/31页 |
| 文件大小： | 0K |
| 描述： | MPU RISC PID7V-603E 255FCCBGA |
| 标准包装： | 60 |
| 系列： | MPC6xx |
| 处理器类型： | 32-位 MPC603e PowerPC |
| 速度： | 200MHz |
| 电压： | 2.5V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 255-BCBGA 裸露焊盘，255-FCCBGA |
| 供应商设备封装： | 255-FCCBGA（21x21） |
| 包装： | 托盘 |
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PID7t-603e Hardware Specifications, Rev. 5
Freescale Semiconductor
23
System Design Information
8.5
Pull-up Resistor Requirements
The 603e requires high-resistive (weak: 10 K
) pull-up resistors on several control signals of the bus
interface to maintain the control signals in the negated state after they have been actively negated and
released by the 603e or other bus master. These signals are: TS, ABB, DBB, and ARTRY.
In addition, the 603e has three open-drain style outputs that require pull-up resistors (weak or stronger:
4.7 K
–10 K) if they are used by the system. These signals are: APE, DPE, and CKSTP_OUT.
During inactive periods on the bus, the address and transfer attributes on the bus are not driven by any
master and may float in the high-impedance state for relatively long periods of time. Since the 603e must
continually monitor these signals for snooping, this float condition may cause excessive power draw by
the input receivers on the 603e. It is recommended that these signals be pulled up through weak (10 K
)
pull-up resistors or restored in some manner by the system. The snooped address and transfer attribute
inputs are—A[0–31], AP[0–3], TT[0–4], TBST, and GBL.
The data bus input receivers are normally turned off when no read operation is in progress and do not
require pull-up resistors on the data bus.
8.6
Thermal Management Information
This section provides thermal management information for the CBGA and PBGA packages for air-cooled
applications. Proper thermal control design is primarily dependent upon the system-level design—the heat
sink, airflow and thermal interface material.
This figure shows the upper and lower limits of the die junction-to-ambient thermal resistance for both
package styles. The lower limit is shown for the case of a densely populated PCB with high thermal
loading of adjacent and neighboring components.
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相关代理商/技术参数 |
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| MPC603RVG300LC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC603RZT200LC | 功能描述:微处理器 - MPU 603E 255PBGA RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC604E | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:PowerPC 604e-TM RISC Microprocessor Technical Summary |
| MPC6071 | 制造商:International Rectifier 功能描述: |
| MPC616 | 制造商:Hammond Manufacturing 功能描述:6" X 16" MAGNET PANEL COVER |
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