参数资料
型号: MPC603RVG200LC
厂商: Freescale Semiconductor
文件页数: 20/31页
文件大小: 0K
描述: MPU RISC PID7V-603E 255FCCBGA
标准包装: 60
系列: MPC6xx
处理器类型: 32-位 MPC603e PowerPC
速度: 200MHz
电压: 2.5V
安装类型: 表面贴装
封装/外壳: 255-BCBGA 裸露焊盘,255-FCCBGA
供应商设备封装: 255-FCCBGA(21x21)
包装: 托盘
PID7t-603e Hardware Specifications, Rev. 5
Freescale Semiconductor
27
System Design Information
Figure 17. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements.
8.6.3
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Tj = Ta + Tr + (jc + int + sa) * Pd
Eqn. 1
where:
Tj is the die-junction temperature
Ta is the inlet cabinet ambient temperature
Tr is the air temperature rise within the computer cabinet
jc is the die junction-to-case thermal resistance
int is the adhesive or interface material thermal resistance
sa is the heat sink base-to-ambient thermal resistance
Pd is the power dissipated by the device
0
0.5
1
1.5
2
0
10
203040
5060
70
80
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
Contact Pressure (psi)
Spe
c
ific
Ther
mal
Re
sistance
(Kin
2
/W
)
相关PDF资料
PDF描述
IDT7006S35J8 IC SRAM 128KBIT 35NS 68PLCC
XF2J-1824-11A CONN FPC 18POS 0.5MM PITCH SMD
IDT7006S25J8 IC SRAM 128KBIT 25NS 68PLCC
IDT7006S20J8 IC SRAM 128KBIT 20NS 68PLCC
MPC862PZQ80B IC MPU PWRQUICC 80MHZ 357-PBGA
相关代理商/技术参数
参数描述
MPC603RVG300LC 功能描述:微处理器 - MPU 603R REV2.1 HIP3 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC603RZT200LC 功能描述:微处理器 - MPU 603E 255PBGA RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324
MPC604E 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:PowerPC 604e-TM RISC Microprocessor Technical Summary
MPC6071 制造商:International Rectifier 功能描述:
MPC616 制造商:Hammond Manufacturing 功能描述:6" X 16" MAGNET PANEL COVER