- 您现在的位置：买卖IC网 > PDF目录4054 > MPC603RVG200LC (Freescale Semiconductor)MPU RISC PID7V-603E 255FCCBGA PDF资料下载
参数资料
| 型号： | MPC603RVG200LC |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 22/31页 |
| 文件大小： | 0K |
| 描述： | MPU RISC PID7V-603E 255FCCBGA |
| 标准包装： | 60 |
| 系列： | MPC6xx |
| 处理器类型： | 32-位 MPC603e PowerPC |
| 速度： | 200MHz |
| 电压： | 2.5V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 255-BCBGA 裸露焊盘，255-FCCBGA |
| 供应商设备封装： | 255-FCCBGA（21x21） |
| 包装： | 托盘 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页当前第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页
PID7t-603e Hardware Specifications, Rev. 5
Freescale Semiconductor
29
Ordering Information
Tj = 30°C + 5°C + (8 °C/W +1.0 °C/W + 7 °C/W) * 3.0 W,
Eqn. 4
resulting in a die-junction temperature of approximately 83 °C that is well within the maximum operating
temperature of the component. Commercially available heat sinks have different heat sink-to-ambient
thermal resistances, and may or may not need air flow.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
figure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat flow. The final die-junction
operating temperature is not only a function of the component-level thermal resistance, but the
system-level design and its operating conditions. In addition to the component’s power consumption, a
number of factors affect the final operating die-junction temperature—airflow, board population (local
heat flux of adjacent components), heat sink efficiency, heat sink attach, heat sink placement, next-level
interconnect technology, system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today’s
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection,
and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models
for the board, as well as, system-level designs. To expedite system-level thermal analysis, several
“compact” thermal-package models are available within FLOTHERM. These are available upon
request.
9
Ordering Information
This figure provides the part numbering nomenclature for the PID7t-603e. Note that the individual part
numbers correspond to a maximum processor core frequency. For available frequencies, contact your local
Freescale sales office.
In addition to the processor frequency, the part numbering scheme also consists of a part modifier and
application modifier. The part modifier indicates any enhancement(s) in the part from the original design.
The application modifier may specify special bus frequencies or application conditions. Each part number
also contains a revision code. This refers to the die mask revision number and is specified in the part
numbering scheme for identification purposes only.
Figure 19. Part Number Key
MPC 603 R RX XXX X X
Product Code
Part Identifier
Part Modifier
Application Modifier
(R = Remapped, Enhanced, Low-Voltage)
(L = Any Valid PLL Configuration)
Package
Processor Frequency
(Contact Freescale Sales Office)
Revision Level
(RX = CBGA without Lid)
(T = Extended Termperature Range)
(ZT = PBGA Package)
(VG = Polymer Core CBGA without Lid)
相关PDF资料 |
PDF描述 |
|---|---|
| IDT7006S35J8 | IC SRAM 128KBIT 35NS 68PLCC |
| XF2J-1824-11A | CONN FPC 18POS 0.5MM PITCH SMD |
| IDT7006S25J8 | IC SRAM 128KBIT 25NS 68PLCC |
| IDT7006S20J8 | IC SRAM 128KBIT 20NS 68PLCC |
| MPC862PZQ80B | IC MPU PWRQUICC 80MHZ 357-PBGA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC603RVG300LC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC603RZT200LC | 功能描述:微处理器 - MPU 603E 255PBGA RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC604E | 制造商:MOTOROLA 制造商全称:Motorola, Inc 功能描述:PowerPC 604e-TM RISC Microprocessor Technical Summary |
| MPC6071 | 制造商:International Rectifier 功能描述: |
| MPC616 | 制造商:Hammond Manufacturing 功能描述:6" X 16" MAGNET PANEL COVER |
发布紧急采购，3分钟左右您将得到回复。