参数资料
型号: MT46H128M32L4MA-54:A
元件分类: DRAM
英文描述: 128M X 32 DDR DRAM, 5 ns, PBGA168
封装: 12 X 12 MM, GREEN, PLASTIC, WFBGA-168
文件页数: 37/106页
文件大小: 3431K
Table 12: Electrical Characteristics and Recommended AC Operating Conditions (Continued)
Notes 1–9 apply to all the parameters in this table; VDD/VDDQ = 1.70–1.95V
Parameter
Symbol
-5
-54
-6
-75
Unit Notes
Min
Max
Min
Max
Min
Max
Min
Max
Data valid output window
(DVW)
n/a
tQH - tDQSQ
ns
Half-clock period
tHP
tCH,
tCL
tCH,
tCL
tCH,
tCL
tCH,
tCL
ns
Data-out High-Z
window from CK/
CK#
CL = 3
tHZ
5.0
5.0
5.0
6.0
ns
CL = 2
6.5
6.5
6.5
6.5
ns
Data-out Low-Z window
from CK/CK#
tLZ
1.0
1.0
1.0
1.0
ns
Address and control input
hold time (fast slew rate)
tIHF
0.9
1.0
1.1
1.3
ns
Address and control input
hold time (slow slew rate)
tIHS
1.1
1.2
1.3
1.5
ns
Address and control input
setup time (fast slew rate)
tISF
0.9
1.0
1.1
1.3
ns
Address and control input
setup time (slow slew rate)
tISS
1.1
1.2
1.3
1.5
ns
Address and control input
pulse width
tIPW
2.3
2.5
2.6
tIS +
tIH
ns
LOAD MODE REGISTER
command cycle time
tMRD
2
2
2
2
tCK
DQ–DQS hold, DQS to first
DQ to go nonvalid, per ac-
cess
tQH
tHP -
tQHS
tHP -
tQHS
tHP -
tQHS
tHP -
tQHS
ns
Data hold skew factor
tQHS
0.5
0.5
0.65
0.75
ns
ACTIVE-to-PRECHARGE
command
tRAS
40
70,000
42
70,000
42
70,000
45
70,000
ns
ACTIVE to ACTIVE/ACTIVE
to AUTO REFRESH com-
mand period
tRC
55
58.2
60
67.5
ns
Active to read or write de-
lay
tRCD
15
16.2
18
22.5
ns
Refresh period
tREF
64
64
64
64
ms
Average periodic refresh
interval: 64Mb, 128Mb,
and 256Mb (x32)
tREFI
15.6
15.6
15.6
15.6
μs
Average periodic refresh
interval: 256Mb, 512Mb,
1Gb, 2Gb
tREFI
7.8
7.8
7.8
7.8
μs
AUTO REFRESH command
period
tRFC
72
72
72
72
ns
2Gb: x16, x32 Mobile LPDDR SDRAM
Electrical Specifications – AC Operating Conditions
PDF: 09005aef83a73286
2gb_ddr_mobile_sdram_t69m.pdf - Rev. M 11/10 EN
36
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2009 Micron Technology, Inc. All rights reserved.
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