参数资料
型号: MT49H16M16FM
厂商: Micron Technology, Inc.
英文描述: REDUCED LATENCY DRAM RLDRAM
中文描述: 低延迟DRAM延迟DRAM
文件页数: 42/43页
文件大小: 652K
代理商: MT49H16M16FM
42
256: x16, x32 RLDRAM
MT49H8M32_3.p65 – Rev. 3, Pub. 6/02
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2002, Micron Technology, Inc.
ADVANCE
256Mb: x16, x32
2.5V V
EXT
, 1.8V V
DD
, 1.8V V
DD
Q, RLDRAM
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron and the M logo are registered trademarks and the Micron logo is a trademark of Micron Technology, Inc.
DATA SHEET DESIGNATION
Advance:
This data sheet contains initial descriptions of products still under development.
144-BALL T-FBGA
SEATING PLANE
0.850 ±0.075
0.155 ±0.013
0.10 C
C
PIN A1 ID
PIN A1 ID
BALL A1
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
1.20 MAX
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 37% Pb, 2%Ag
SOLDER BALL PAD: .33mm
18.50 ±0.10
17.00
1.00
(TYP)
4.40 ±0.05
11.00 ±0.10
5.50 ±0.05
8.50 ±0.05
9.25 ±0.05
TYP
BALL A12
144X .45
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE
PRE-REFLOW DIAMETER
IS 0.40
C
L
C
L
8.80
2.20 ±0.05
CTR
0.80
(TYP)
NOTE:
1. All dimensions in millimeters.
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