Analog Integrated Circuit Device Data
Freescale Semiconductor
11
13892
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not
available from Freescale for import or sale in the United States prior to September 2010: MC13892*VK and MC13892*VL in 139, 186 MAPBGA packages.
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Charger and USB Input Voltage
(1)VCHRGR
-0.3 to 20
V
MODE pin Voltage
VMODE
-0.3 to 9.0
V
Main/Aux/Keypad Current Sink Voltage
VLEDMD,
VLEDAD,
VLEDKP
-0.3 to 28
V
Battery Voltage
VBATT
-0.3 to 4.8
V
Coin Cell Voltage
VLICELL
-0.3 to 3.6
V
Human Body Model - HBM with Mode pin excluded
(4)Charge Device Model - CDM
VESD
±1500
±250
V
THERMAL RATINGS
Ambient Operating Temperature Range
TA
-30 to +85
°C
Operating Junction Temperature Range
TJ
-30 to +125
°C
Storage Temperature Range
TSTG
-65 to +150
°C
THERMAL RESISTANCE
Peak Package Reflow Temperature During Refl
ow(2),
(3)TPPRT
°C
Notes
1.
USB Input Voltage applies to UVBUS pin only
1.
ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω) and the Charge Device
Model (CDM), Robotic (CZAP = 4.0pF).
2.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
4.
Mode Pin is not ESD protected.
Table 3. Dissipation Ratings
Rating Parameter
Condition
Symbol
VK Package
VL Package
Unit
Junction to Ambient Natural Convection
Single layer board (1s)
R
θJA
104
65
°C/W
Junction to Ambient Natural Convection
Four layer board (2s2p)
R
θJMA
54
42
°C/W
Junction to Ambient (@200 ft/min)
Single layer board (1s)
R
θJMA
88
55
°C/W
Junction to Ambient (@200 ft/min)
Four layer board (2s2p)
R
θJMA
49
38
°C/W
Junction to Board
R
θJB
32
28
°C/W
Junction to Case
R
θJC
29
22
°C/W
Junction to Package Top
Natural Convection
θJT
7
5
°C/W