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| 型号： | S1C17651B00E10C |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 16-BIT, FLASH, 2 MHz, RISC MICROCONTROLLER, PBGA |
| 文件页数： | 122/216页 |
| 文件大小： | 1784K |
| 代理商： | S1C17651B00E10C |
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APPENDIX C MOUNTING PRECAUTIONS
S1C17651 TECHNICAL MANUAL
Seiko Epson Corporation
AP-C-1
Appendix C Mounting Precautions
This section describes various precautions for circuit board design and IC mounting.
Oscillator circuit
Oscillation characteristics depend on factors such as components used (resonator, CG, CD) and circuit board
patterns. In particular, with ceramic or crystal resonators, select the appropriate capacitors (CG, CD) only af-
ter fully evaluating components actually mounted on the circuit board.
Oscillator clock disturbances caused by noise may cause malfunctions. To prevent such disturbances, consid-
er the following points. The latest devices, in particular, are manufactured by microscopic processes, making
them especially susceptible to noise.
Areas in which noise countermeasures are especially important include the OSC2 pin and related circuit
components and wiring. OSC1 pin handling is equally important. The noise precautions required for the
OSC1 and OSC2 pins are described below. We also recommend applying similar noise countermeasures to
the high-speed oscillator circuit, such as the OSC3 and OSC4 pins and wiring.
(1) Components such as a resonator, resistors, and capacitors connected to the OSC1 (OSC3) and OSC2 (OSC4)
pins should have the shortest connections possible.
(2) Wherever possible, avoid locating digital signal lines within 3 mm of the OSC1 (OSC3) and OSC2 (OSC4)
pins or related circuit components and wiring. Rapidly-switching signals, in particular, should be kept at a
distance from these components. Since the spacing between layers of multi-layer printed circuit boards is
a mere 0.1 mm to 0.2 mm, the above precautions also apply when positioning digital signal lines on other
layers.
Never place digital signal lines alongside such components or wiring, even if more than 3 mm distance or
located on other layers. Avoid crossing wires.
(3) Use VSS to shield OSC1 (OSC3) and OSC2 (OSC4) pins and related wiring
(including wiring for adjacent circuit board layers). Layers wired should
be adequately shielded as shown to the right. Fully ground adjacent lay-
ers, where possible. At minimum, shield the area at least 5 mm around the
above pins and wiring.
Even after implementing these precautions, avoid configuring digital signal
lines in parallel, as described in (2) above. Avoid crossing even on discrete
layers, except for lines carrying signals with low switching frequencies.
(4) After implementing these precautions, check the output clock waveform by running the actual application
program within the product. Use an oscilloscope to check the FOUTA or FOUTB pin output.
You can check the quality of the OSC3 output waveform via the FOUTA/B output. Confirm that the fre-
quency is as designed, is free of noise, and has minimal jitter.
You can check the quality of the OSC1 waveform via the FOUTA/B output. In particular, enlarge the areas
before and after the clock rising and falling edges and take special care to confirm that the regions approxi-
mately 100 ns to either side are free of clock or spiking noise.
Failure to observe precautions (1) to (3) adequately may lead to jitter in the OSC3 output and noise in the
OSC1 output. Jitter in the OSC3 output will reduce operating frequencies, while noise in the OSC1 output
will destabilize timers operated by the OSC1 clock as well as CPU Core operations when the system clock
switches to OSC1.
Reset circuit
The reset signal input to the #RESET pin when power is turned on will vary, depending on various factors,
such as power supply start-up time, components used, and circuit board patterns. Constants such as capaci-
tance and resistance should be determined through testing with real-world products.
Components such as capacitors and resistors connected to the #RESET pin should have the shortest connec-
tions possible to prevent noise-induced resets.
OSC4
OSC3
VSS
Sample VSS pattern (OSC3)
相关PDF资料 |
PDF描述 |
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| S1C17651B00E10E | 16-BIT, FLASH, 2 MHz, RISC MICROCONTROLLER, PBGA |
| S1C17651B00E10H | 16-BIT, FLASH, 2 MHz, RISC MICROCONTROLLER, PBGA |
| S1C17651B00E10K | 16-BIT, FLASH, 2 MHz, RISC MICROCONTROLLER, PBGA |
| S1C17651B00E10N | 16-BIT, FLASH, 2 MHz, RISC MICROCONTROLLER, PBGA |
| S1C17651D00E10B | 16-BIT, FLASH, 2 MHz, RISC MICROCONTROLLER, UUC50 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S1C17653 | 制造商:EPSON 制造商全称:EPSON 功能描述:16-bit Single Chip Microcontroller |
| S1C17701 | 制造商:EPSON 制造商全称:EPSON 功能描述:CMOS 16-bit Single Chip Microcontroller |
| S1C17701D101000 | 制造商:Seiko Instruments Inc (SII) 功能描述:EPSON 16BIT MCU |
| S1C17701F00B100 | 功能描述:16位微控制器 - MCU 16-bit 64KB Flash LCD 56x32 RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT |
| S1C17701F00E100 | 功能描述:16位微控制器 - MCU 16-bit 64KB Flash LCD 56x32 RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT |
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