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参数资料
| 型号： | SSTUP32866EC/S |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 锁存器 |
| 英文描述： | 32866 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA96 |
| 封装： | 13.50 X 5.50 MM, 1.05 MM HEIGHT, LEAD FREE, PLASTIC, SOT-536-1, LFBGA-96 |
| 文件页数： | 12/31页 |
| 文件大小： | 538K |
| 代理商： | SSTUP32866EC/S |
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SSTUP32866_2
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 14 September 2006
2 of 31
Philips Semiconductors
SSTUP32866
1.8 V DDR2-667/800 programmable registered buffer with parity
I Available in 96-ball, 13.5 mm × 5.5 mm, 0.8 mm ball pitch LFBGA package
3.
Applications
I 667 MT/s to 800 MT/s DDR2 registered DIMMs desiring parity checking functionality
4.
Ordering information
4.1 Ordering options
Table 1.
Ordering information
Type number
Solder process
Package
Name
Description
Version
SSTUP32866EC/G
Pb-free (SnAgCu solder
ball compound)
LFBGA96
plastic low prole ne-pitch ball grid array package;
96 balls; body 13.5
× 5.5 × 1.05 mm
SOT536-1
SSTUP32866EC/S
Pb-free (SnAgCu solder
ball compound)
LFBGA96
plastic low prole ne-pitch ball grid array package;
96 balls; body 13.5
× 5.5 × 1.05 mm
SOT536-1
Table 2.
Ordering options
Type number
Temperature range
SSTUP32866EC/G
Tamb = 0 °C to +70 °C
SSTUP32866EC/S
Tamb = 0 °C to +85 °C
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