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参数资料
| 型号： | SSTUP32866EC/S |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 锁存器 |
| 英文描述： | 32866 SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, PBGA96 |
| 封装： | 13.50 X 5.50 MM, 1.05 MM HEIGHT, LEAD FREE, PLASTIC, SOT-536-1, LFBGA-96 |
| 文件页数： | 21/31页 |
| 文件大小： | 538K |
| 代理商： | SSTUP32866EC/S |
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SSTUP32866_2
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 14 September 2006
28 of 31
Philips Semiconductors
SSTUP32866
1.8 V DDR2-667/800 programmable registered buffer with parity
[3]
These transparent plastic packages are extremely sensitive to reow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reow soldering with
peak temperature exceeding 217
°C ± 10 °C measured in the atmosphere of the reow oven. The package
body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex foil by
using a hot bar soldering process. The appropriate soldering prole can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Abbreviations
Table 17.
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide Semiconductor
DDR
Double Data Rate
DIMM
Dual In-line Memory Module
LVCMOS
Low Voltage Complementary Metal Oxide Semiconductor
PPO
Partial Parity Out
PRR
Pulse Repetition Rate
RDIMM
Registered Dual In-line Memory Module
SSTL
Stub Series Terminated Logic
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