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参数资料
型号： ADSP-21363KSWZ-1AA
厂商： Analog Devices Inc
文件页数： 47/60页
文件大小： 0K
描述： IC DSP 32BIT 333MHZ EPAD 144LQFP
产品培训模块： SHARC Processor Overview
标准包装： 1
系列： SHARC®
类型： 浮点
接口： DAI，SPI
时钟速率： 333MHz
非易失内存： ROM（512 kB）
芯片上RAM： 384kB
电压 - 输入/输出： 3.30V
电压 - 核心： 1.20V
工作温度： 0°C ~ 70°C
安装类型： 表面贴装
封装/外壳： 144-LQFP 裸露焊盘
供应商设备封装： 144-LQFP（20x20）
包装： 托盘
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Values of θ JC are provided for package comparison and PCB
10
8
design considerations when an exposed pad is required. Note
that the thermal characteristics values provided in Table 42
through Table 44 are modeled values.
6
4
y = 0.04 88 x - 1.592 3
Table 42. Thermal Characteristics for BGA (No Thermal vias
in PCB)
2
0
-2
Parameter
θ JA
θ JMA
θ JMA
θ JC
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
25.40
21.90
20.90
5.07
Unit
°C/W
°C/W
°C/W
°C/W
-4
0
50
100
150
200
Ψ JT
Ψ JMT
Airflow = 0 m/s
Airflow = 1 m/s
0.140
0.330
°C/W
°C/W
LOAD CAPACITANCE (pF)
Ψ JMT
Airflow = 2 m/s
0.410
°C/W
Figure 42. Typical Output Delay or Hold versus Load Capacitance
(at Ambient Temperature)
Table 43. Thermal Characteristics for BGA (Thermal vias in
PCB)
THERMAL CHARACTERISTICS
The processor is rated for performance over the temperature
range specified in Operating Conditions on Page 14 .
Table 42 through Table 44 airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. Test board and
thermal via design comply with JEDEC standards JESD51-9
(BGA) and JESD51-5 (LQFP_EP). The junction-to-case mea-
surement complies with MIL-STD-883. All measurements use a
Parameter
θ JA
θ JMA
θ JMA
θ JC
Ψ JT
Ψ JMT
Ψ JMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
23.40
20.00
19.20
5.00
0.130
0.300
0.360
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
2S2P JEDEC test board.
Industrial applications using the BGA package require thermal
vias, to an embedded ground plane, in the PCB. Refer to JEDEC
Table 44. Thermal Characteristics for LQFP_EP (with
Exposed Pad Soldered to PCB)
standard JESD51-9 for printed circuit board thermal ball land
and thermal via design information.
Industrial applications using the LQFP_EP package require
thermal trace squares and thermal vias, to an embedded ground
plane, in the PCB. Refer to JEDEC standard JESD51-5 for more
information.
To determine the junction temperature of the device while on
the application PCB, use:
T J = T T + ? ? JT ? P D ?
Parameter
θ JA
θ JMA
θ JMA
θ JC
Ψ JT
Ψ JMT
Ψ JMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
16.80
14.20
13.50
7.25
0.51
0.72
0.80
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
where:
T J = junction temperature ( ° C)
T T = case temperature ( ° C) measured at the top center of the
package
Ψ JT = junction-to-top (of package) characterization parameter
is the typical value from Table 42 through Table 44 .
P D = power dissipation. See the Engineer-to-Engineer Note
“ Estimating Power for the ADSP-21362 SHARC Processors ”
(EE-277) for more information.
Values of θ JA are provided for package comparison and PCB
design considerations.
Rev. J |
Page 47 of 60 |
July 2013
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