参数资料
型号: EP2C20F256I6N
厂商: ALTERA CORP
元件分类: FPGA
英文描述: FPGA, 1196 CLBS, PBGA256
封装: LEAD FREE, FBGA-256
文件页数: 98/168页
文件大小: 2206K
代理商: EP2C20F256I6N
Altera Corporation
2–23
February 2007
Cyclone II Device Handbook, Volume 1
Cyclone II Architecture
Global Clock Network Distribution
Cyclone II devices contains 16 global clock networks. The device uses
multiplexers with these clocks to form six-bit buses to drive column IOE
clocks, LAB row clocks, or row IOE clocks (see Figure 2–14). Another
multiplexer at the LAB level selects two of the six LAB row clocks to feed
the LE registers within the LAB.
Figure 2–14. Global Clock Network Multiplexers
LAB row clocks can feed LEs, M4K memory blocks, and embedded
multipliers. The LAB row clocks also extend to the row I/O clock regions.
IOE clocks are associated with row or column block regions. Only six
global clock resources feed to these row and column regions. Figure 2–15
shows the I/O clock regions.
Clock [15 or 7..0]
Row I/O Region
IO_CLK [5..0]
Column I/O Region
IO_CLK [5..0]
LAB Row Clock
LABCLK[5..0]
Global Clock
Network
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EP2C20F256I8 功能描述:FPGA - 现场可编程门阵列 FPGA - Cyclone II 1172 LABs 152 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2C20F256I8GA 制造商:Altera Corporation 功能描述:
EP2C20F256I8N 功能描述:FPGA - 现场可编程门阵列 FPGA - Cyclone II 1172 LABs 152 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2C20F484C6 功能描述:FPGA - 现场可编程门阵列 FPGA - Cyclone II 1172 LABs 315 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2C20F484C6N 功能描述:FPGA - 现场可编程门阵列 FPGA - Cyclone II 1172 LABs 315 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256