参数资料
型号: IBM25EMPPC750EBUF2000
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 200 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 13/43页
文件大小: 431K
代理商: IBM25EMPPC750EBUF2000
Preliminary and subject to change without notice
PPC740 and PPC750 Hardware Specifications
20 of 43
4.0 PPC740 and PPC750 Microprocessor Pin Assignments
The following sections contain the pinout diagrams for the PPC740 and PPC750. IBM
offers two ceramic ball grid array (BGA) packages: a 255 CBGA (the PPC740) and a 360
CBGA (the PPC750).
Figure 13 (in part A) shows the pinout of the 255 CBGA package as viewed from the top
surface. Part B shows the side prole of the 255 CBGA package to indicate the direc-
tion of the top surface view.
Figure 13. Pinout of the PPC740 BGA Package as Viewed from the Top Surface
Figure 14 (in part A) shows the pinout of the 360 CBGA package as viewed from the top
surface. Part B shows the side prole of the 360 CBGA package to indicate the direc-
tion of the top surface view.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Not to Scale
Substrate
Assem-
Encapsulation
View
Part B
Die
Part A
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