- 您现在的位置：买卖IC网 > PDF目录261241 > IBM25EMPPC750EBUF2000 32-BIT, 200 MHz, RISC PROCESSOR, CBGA360 PDF资料下载
参数资料
| 型号： | IBM25EMPPC750EBUF2000 |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 31/43页 |
| 文件大小： | 431K |
| 代理商： | IBM25EMPPC750EBUF2000 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页当前第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页
Preliminary and subject to change without notice
PPC740 and PPC750 Hardware Specifications
37 of 43
Ultimately, the nal selection of an appropriate heat sink for the PPC740 and PPC750
depends on many factors, such as thermal performance at a given air velocity, spatial
volume, mass, attachment method, assembly, and cost.
7.7.1 Internal Package Conduction Resistance
For the exposed-die packaging technology, shown in Table 3 , the intrinsic conduction
thermal resistance paths are as follows:
The die junction-to-case thermal resistance
The die junction-to-lead thermal resistance
Figure 20 depicts the primary heat transfer path for a package with an attached heat
sink mounted to a printed-circuit board.
Figure 20. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Heat generated on the active side (ball) of the chip is conducted through the silicon,
then through the heat sink attach material (or thermal interface material), and nally
to the heat sink where it is removed by forced-air convection. Since the silicon thermal
resistance is quite small, for a rst-order analysis, the temperature drop in the silicon
may be neglected. Thus, the heat sink attach material and the heat sink conduction/
convective thermal resistances are the dominant terms.
7.7.2 Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface
to minimize the thermal contact resistance. For those applications where the heat sink
is attached by a spring clip mechanism, Figure 21 shows the thermal performance of
three thin-sheet thermal-interface materials (silicon, graphite/oil, oroether oil), a bare
joint, and a joint with thermal grease as a function of contact pressure. As shown, the
performance of these thermal interface materials improves with increasing contact
pressure. The use of thermal grease signicantly reduces the interface thermal resis-
tance. That is, the bare joint results in a thermal resistance approximately 7 times
External Resistance
Internal Resistance
(Note the internal versus external package
Radiation
Convection
Radiation
Convection
Heat Sink
Die/Package
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Chip Junction
相关PDF资料 |
PDF描述 |
|---|---|
| ICS2494AM-XXX | 135 MHz, VIDEO CLOCK GENERATOR, PDSO20 |
| ICS650R-14IT | 133.33 MHz, OTHER CLOCK GENERATOR, PDSO20 |
| ICS650R-14T | 133.33 MHz, OTHER CLOCK GENERATOR, PDSO20 |
| ICS840001AKI-34LF | 213.33 MHz, OTHER CLOCK GENERATOR, QCC16 |
| I2041AG-8TR | 40.4 MHz, OTHER CLOCK GENERATOR, PDSO8 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IBM25EMPPC750LEBA300 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
| IBM25EMPPC750LEBA333 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
| IBM25EMPPC750LEBA366 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
| IBM25EMPPC750LEBA400 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
| IBM25EMPPC750LEBA466 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:32-Bit Microprocessor |
发布紧急采购，3分钟左右您将得到回复。