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| 型号： | IBM25EMPPC750EBUF2000 |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, CBGA360 |
| 封装： | 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 |
| 文件页数： | 33/43页 |
| 文件大小： | 431K |
| 代理商： | IBM25EMPPC750EBUF2000 |
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Preliminary and subject to change without notice
PPC740 and PPC750 Hardware Specifications
39 of 43
The board designer can choose between several types of thermal interfaces. Heat sink
adhesive materials should be selected based upon high conductivity, yet adequate
mechanical strength to meet equipment shock/vibration requirements. There are sev-
eral commercially-available thermal interfaces and adhesive materials provided by the
following vendors:
Dow-Corning Corporation
517-496-4000
Dow-Corning Electronic Materials
P.O. Box 0997
Midland, MI 48686-0997
Chomerics, Inc.
617-935-4850
77 Dragon Court
Woburn, MA 01888-4850
Thermagon, Inc.
216-741-7659
3256 West 25th Street
Cleveland, OH 44109-1668
Loctite Corporation
860-571-5100
1001 Trout Brook Crossing
Rocky Hill, CT 06067
AI Technology (e.g. EG7655)
609-882-2332
1425 Lower Ferry Road
Trent, NJ 08618
The following section provides a heat sink selection example using one of the commer-
cially available heat sinks.
7.8 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as fol-
lows:
Tj = Ta + Tr + (θjc + θint + θsa) * Pd
Where:
Tj is the die-junction temperature
Ta is the inlet cabinet ambient temperature
Tr is the air temperature rise within the system cabinet
θ
jc is the junction-to-case thermal resistance
θ
int is the thermal resistance of the thermal interface material
θ
sa is the heat sink-to-ambient thermal resistance
Pd is the power dissipated by the device
Typical die-junction temperatures (Tj) should be maintained less than the value speci-
ed in Table 3 . The temperature of the air cooling the component greatly depends
upon the ambient inlet air temperature and the air temperature rise within the com-
puter cabinet. An electronic cabinet inlet-air temperature (Ta) may range from 30 to 40
°C. The air temperature rise within a cabinet (T
r) may be in the range of 5 to 10 °C. The
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