参数资料
型号: IBM25EMPPC750EBUF2000
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 200 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 32/43页
文件大小: 431K
代理商: IBM25EMPPC750EBUF2000
Preliminary and subject to change without notice
PPC740 and PPC750 Hardware Specifications
38 of 43
greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the
printed-circuit board (see Figure 19 ). This spring force should not exceed 5.5 pounds.
Therefore the synthetic grease offers the best thermal performance, considering the low
interface pressure. Of course, the selection of any thermal interface material depends
on many factors -- thermal performance requirements, manufacturability, service tem-
perature, dielectric properties, cost, etc.
Figure 21. Thermal Performance of Select Thermal Interface Material
Specic
Thermal
Resistance
(Kin
2
/W)
0
0.5
1
1.5
2
0
10
20
30
40
50
60
70
80
Contact Pressure (PSI)
+
Silicone Sheet (0.006 inch)
Bare Joint
Floroether Oil Sheet (0.007 inch)
Graphite/Oil Sheet (0.005 inch)
Synthetic Grease
+
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