参数资料
型号: IBM25EMPPC750EBUF2000
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 200 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 17/43页
文件大小: 431K
代理商: IBM25EMPPC750EBUF2000
Preliminary and subject to change without notice
PPC740 and PPC750 Hardware Specifications
24 of 43
Note:
1. These are test signals for factory use only and must be pulled up to OVdd for normal operation.
2. OVdd inputs supply power to the I/O drivers and Vdd inputs supply power to the processor core.
3. Internally tied to GND in the 255 CBGA package to indicate to the power supply that a low-voltage pro-
cessor is present. This is NOT a supply pin.
Table 15 provides the pinout listing for the 360 CBGA package (the PPC750).
Table 15. Pinout Listing for the 360 CBGA package
Signal Name
Pin Number
Active
I/O
A0-A31
A13, D2, H11, C1, B13, F2, C13, E5, D13, G7, F12,
G3, G6, H2, E2, L3, G5, L4, G4, J4, H7, E1, G2, F3,
J7, M3, H3, J2, J6, K3, K2, L2
High
I/O
AACK
N3
Low
Input
ABB
L7
Low
I/O
AP0-AP3
C4, C5, C6, C7
High
I/O
ARTRY
L6
Low
I/O
AVDD
A8
BG
H1
Low
Input
BR
E7
Low
Output
CKSTP_OUT
D7
Low
Output
CI
C2
Low
Output
CKSTP_IN
B8
Low
Input
CLKOUT
E3
--
Output
DBB
K5
Low
I/O
DBDIS
G1
Low
Input
DBG
K1
Low
Input
DBWO
D1
Low
Input
DH0-DH31
W12, W11, V11, T9, W10, U9, U10, M11, M9, P8,
W7, P9, W9, R10, W6, V7, V6, U8, V9, T7, U7, R7,
U6, W5, U5, W4, P7, V5, V4, W3, U4, R5
High
I/O
DL0-DL31
M6, P3, N4, N5, R3, M7, T2, N6, U2, N7, P11, V13,
U12, P12, T13, W13, U13, V10, W8, T11, U11, V12,
V8, T1, P1, V1, U1, N1, R2, V3, U3, W2
High
I/O
DP0-DP7
L1, P2, M2, V2, M1, N2, T3, R1
High
I/O
DRTRY
H6
Low
Input
GBL
B1
Low
I/O
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