参数资料
型号: IBM25EMPPC750EBUF2000
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 200 MHz, RISC PROCESSOR, CBGA360
封装: 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
文件页数: 19/43页
文件大小: 431K
代理商: IBM25EMPPC750EBUF2000
Preliminary and subject to change without notice
PPC740 and PPC750 Hardware Specifications
26 of 43
Notes:
1. These are test signals for factory use only and must be pulled up to OVdd for normal machine opera-
tion.
2. OVdd inputs supply power to the I/O drivers and Vdd inputs supply power to the processor core.
3. Internally tied to L2OVDD in the PID-8t PPC750 360 CBGA package to indicate to the power supply
that a 2.5v core voltage processor is present. Future lower core voltage processors may tie this pin
internally to GND. CAUTION: this is different from the 255 CBGA package. This is NOT a supply pin.
4. These pins are reserved for potential future use as additional L2 address pins.
QREQ
J3
Low
Output
RSRV
D3
Low
Output
SMI
A12
Low
Input
SRESET
E10
Low
Input
SYSCLK
H9
Input
TA
F1
Low
Input
TBEN
A2
High
Input
TBST
A11
Low
I/O
TCK
B10
High
Input
TDI
B7
High
Input
TDO
D9
High
Output
TEA
J1
Low
Input
TLBISYNC
A3
Low
Input
TMS
C8
High
Input
TRST
A10
Low
Input
TS
K7
Low
I/O
TSIZ0-TSIZ2
A9, B9, C9
High
Output
TT0-TT4
C10, D11, B12, C12, F11
High
I/O
WT
C3
Low
Output
VDD 2
G8, G10, G12, J8, J10, J12, L8, L10, L12, N8, N10,
N12
——
VOLTDET3
K13
High
Output
Table 15. Pinout Listing for the 360 CBGA package (Continued)
Signal Name
Pin Number
Active
I/O
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