参数资料
型号: IDT88P8342BHGI
厂商: IDT, Integrated Device Technology Inc
文件页数: 27/98页
文件大小: 0K
描述: IC SPI3-SPI4 EXCHANGE 820-PBGA
标准包装: 24
系列: *
其它名称: 88P8342BHGI
33
IDT88P8342 SPI EXCHANGE 2 x SPI-3 TO SPI-4
INDUSTRIALTEMPERATURERANGE
APRIL 10, 2006
4.3 SPI-3 ingress to SPI-3 egress datapath
TheSPI-3redirectbuffercanstoreSPI-3packetfragments.Thestatusofthe
packetfragmentbuffersisforwardedtotheassociatedpacketfragmentproces-
sor. The purpose of the SPI-3 redirect is to enable per-LP flows between
physical interfaces SPI-3 A and SPI-3 B. Other flows between SPI-3 ports are
not allowed; i.e., between A and A, and between B and B.
The following is a description of the path taken by a fragment of data through
the device.
A SPI-3 to SPI-3 path is between an LP on one SPI-3 to the paired SPI-3.
Data enters on the SPI-3 interface in fragments. Fragments are of equal length
except the last fragment of a packet which may be shorter. The LP address is
in-band with the data. The packet fragment enters an ingress buffer. SPI-3 LP
address, error information, SOP, and EOP information is are stored with the
fragment. The LP address is mapped to a LID. The fragment is stored in buffer
segment pool per-LID-allocated memory space.
The Table 80, SPI-3 egress port descriptor table (64 entries) is consulted,
and the PFP decides to send a LID to the associated SPI-3 egress port. The
SPI-3 packet fragment processor chooses the next LP. The choice of LP is
dependent on status of the LP and availability of a complete fragment. Data is
moved to an egress buffer along with the SPI-3 LP address, error information,
SOP,andEOPinformation.DataistransmittedinpacketfragmentsoveraSPI-
3interface.
The paths to and from the microprocessor interface can be used to perform
mappings from a SPI-3 LP to a SPI-3 LP where not provided, and from a SPI-
4 to a SPI-4 LP. However these paths are limited by the bandwidth of the
microprocessorinterface.
The diagram below shows the datapath through the device from a SPI-3
interfacetoitspairedSPI-3interface.FortheSPI-3redirect,theLIDconnecting
associated port pairs must be the same in both directions.
Figure 21. SPI-3 ingress to SPI-3 egress datapath
SPI-3 /
LID map
SPI-3
8 bit / 32 bit
Min: 19.44MHz
Max: 133MHz
SPI-3
8 bit / 32 bit
Min: 19.44MHz
Max: 133MHz
SPI-4.2
Min: 80 MHz
Max: 400 MHz
JTAG
uproc
Chip Counters Memory
LID Counters Memory
Interface
Bloc
k
SPI-4 /
LID map
SPI-3 /
LID map
LID Counters Memory
Main
Memory
A
Main
Memory
B
6370 drw14
Interface
Bloc
k
Interface
Bloc
k
相关PDF资料
PDF描述
LT1528CT IC REG LDO 3.3V/ADJ 3A TO220-5
RCE40DHFT CONN EDGECARD 80POS 1MM SMD
RBE40DHFT CONN EDGECARD 80POS 1MM SMD
MIC5295-3.0YD TR IC REG LDO 3V .15A TO-252-5
LT3015IMSE#TRPBF IC REG LDO NEG ADJ 1.5A 12MSOP
相关代理商/技术参数
参数描述
IDT88P8342BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8344 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0
IDT88P8344BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8344BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT89H10T4BG2ZBBC 制造商:Integrated Device Technology Inc 功能描述:IC PCI SW 10LANE 4PORT 324BGA