参数资料
型号: IDT88P8342BHGI
厂商: IDT, Integrated Device Technology Inc
文件页数: 84/98页
文件大小: 0K
描述: IC SPI3-SPI4 EXCHANGE 820-PBGA
标准包装: 24
系列: *
其它名称: 88P8342BHGI
85
IDT88P8342 SPI EXCHANGE 2 x SPI-3 TO SPI-4
INDUSTRIALTEMPERATURERANGE
APRIL 10, 2006
Figure 37. Microprocessor parallel port Motorola read timing diagram
6370 drw07
Valid Address
READ DBUS[7:0]
Valid Data
tRecovery
ADD[5:0]
R/WB
DSB + CSB
tDW
tRC
tRWH
tRWV
tAV
tADH
tPRD
tDAZ
11.6.6.1 Microprocessor parallel port AC timing
specifications
BesuretoconnectSPI_ENtoalogiclowwhenusingtheparallelPinterface
mode.
Read cycle specification Motorola non-multiplexed (MPM=0)
Symbol
Parameter
MIN
MAX
Unit
T
Internal main clock period (MCLK)
80
100
MHz
tRC
Read cycle time
5.5T+25
ns
tDW
Valid DSB width
5.5T+20
ns
tRWV
Delay from DSB to valid read signal
T/2-4
ns
tRWH
R/WB to DSB hold time
2T+10
ns
tAV
Delay from DSB to Valid Address
T/2-4
ns
tADH
Address to DSB hold time
2T+10
ns
tRPD
DSB to valid read data propagation delay
5.5T+20
ns
tDAZ
Delay from read data active to high Z
12
ns
tRecovery Recovery time from read cycle
5
ns
TABLE 138 – MICROPROCESSOR PARALLEL PORT MOTOROLA READ TIMING
相关PDF资料
PDF描述
LT1528CT IC REG LDO 3.3V/ADJ 3A TO220-5
RCE40DHFT CONN EDGECARD 80POS 1MM SMD
RBE40DHFT CONN EDGECARD 80POS 1MM SMD
MIC5295-3.0YD TR IC REG LDO 3V .15A TO-252-5
LT3015IMSE#TRPBF IC REG LDO NEG ADJ 1.5A 12MSOP
相关代理商/技术参数
参数描述
IDT88P8342BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8344 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0
IDT88P8344BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8344BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT89H10T4BG2ZBBC 制造商:Integrated Device Technology Inc 功能描述:IC PCI SW 10LANE 4PORT 324BGA