参数资料
型号: MT48H8M16LFB4-75:K TR
厂商: Micron Technology Inc
文件页数: 57/63页
文件大小: 0K
描述: IC SDRAM 128MBIT 133MHZ 54VFBGA
标准包装: 1
格式 - 存储器: RAM
存储器类型: 移动 SDRAM
存储容量: 128M(8Mx16)
速度: 133MHz
接口: 并联
电源电压: 1.7 V ~ 1.95 V
工作温度: 0°C ~ 70°C
封装/外壳: 54-VFBGA
供应商设备封装: 54-VFBGA(8x8)
包装: 标准包装
其它名称: 557-1531-6
128Mb: x16 Mobile SDRAM
Timing Diagrams
Figure 43:
WRITE – Without Auto Precharge
C LK
T0
t C K S
t C KH
t C K
T1
t C L
T2
t C H
T3
T4
T5
T 6
T7
T8
T9
C KE
t C M S
t C MH
C OMMAND
A C TIVE
NOP
WRITE
NOP
NOP
NOP
NOP
PRE C HAR G E
NOP
A C TIVE
t C M S t C MH
DQM
tA S
tAH
A0–A9, A11
A10
ROW
tA S
tAH
ROW
C OLUMN m 3
ALL BANK S
ROW
ROW
tA S
tAH
DI S ABLE AUTO PRE C HAR G E
S IN G LE BANK
BA0, BA1
BANK
BANK
BANK
BANK
t D S
tDH
t D S
tDH
t D S
tDH
t D S
tDH
DQ
tR C D
D IN m
D IN m + 1
D IN m + 2
D IN m + 3
t WR 2
tRP
tRA S
tR C
DON ’ T C ARE
Notes:
1. For this example, BL = 4, and the WRITE burst is followed by a “manual” PRECHARGE.
2. 15ns is required between <D IN m + 3> and the PRECHARGE command, regardless of fre-
quency.
3. A9 and A11 are “Don’t Care.”
PDF: 09005aef8237e877/Source: 09005aef8237e8d8
128Mb_x16 Mobile SDRAM_Y25M_2.fm - Rev. C 2/07 EN
57
Micron Technology, Inc., reserves the right to change products or specifications without notice.
?2006 Micron Technology, Inc. All rights reserved.
相关PDF资料
PDF描述
HSM44DRYI CONN EDGECARD 88POS DIP .156 SLD
HMM44DRYI CONN EDGECARD 88POS DIP .156 SLD
RSC49DRYI-S734 CONN EDGECARD 98POS DIP .100 SLD
RMC49DRYI-S734 CONN EDGECARD 98POS DIP .100 SLD
EP4CGX30BF14C8 IC CYCLONE IV GX FPGA 30K 169FBG
相关代理商/技术参数
参数描述
MT48H8M16LFB4-8 制造商:Micron Technology Inc 功能描述:IC SDRAM 128MBIT 125MHZ 54VFBGA
MT48H8M16LFB4-8 IT 制造商:Micron Technology Inc 功能描述:IC SDRAM 128MBIT 125MHZ 54VFBGA
MT48H8M16LFB4-8 IT TR 功能描述:IC SDRAM 128MBIT 125MHZ 54VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:96 系列:- 格式 - 存储器:闪存 存储器类型:FLASH 存储容量:16M(2M x 8,1M x 16) 速度:70ns 接口:并联 电源电压:2.65 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:48-TFSOP(0.724",18.40mm 宽) 供应商设备封装:48-TSOP 包装:托盘