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参数资料
| 型号： | NAND256W3A0AN6F |
| 厂商： | NUMONYX |
| 元件分类： | PROM |
| 英文描述： | 32M X 8 FLASH 3V PROM, 35 ns, PDSO48 |
| 封装： | 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48 |
| 文件页数： | 10/58页 |
| 文件大小： | 1406K |
| 代理商： | NAND256W3A0AN6F |
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Bus operations
NAND128-A, NAND256-A
4
Bus operations
There are six standard bus operations that control the memory. Each of these is described
in this section, see Table 5: Bus operations for a summary.
4.1
Command input
Command input bus operations give commands to the memory. Commands are accepted
when Chip Enable is Low, Command Latch Enable is High, Address Latch Enable is Low,
and Read Enable is High. They are latched on the rising edge of the Write Enable signal.
Only I/O0 to I/O7 input commands.
program erase endurance cycles for details of the timings requirements.
4.2
Address input
Address input bus operations input the memory address. Three bus cycles are required to
input the addresses (refer to Tables Table 6: Address insertion, x8 devices and Table 7:
The addresses are accepted when Chip Enable is Low, Address Latch Enable is High,
Command Latch Enable is Low, and Read Enable is High. They are latched on the rising
edge of the Write Enable signal. Only I/O0 to I/O7 input addresses.
program erase endurance cycles for details of the timings requirements.
4.3
Data input
Data input bus operations input the data to be programmed.
Data is accepted only when Chip Enable is Low, Address Latch Enable is Low, Command
Latch Enable is Low, and Read Enable is High. The data is latched on the rising edge of the
Write Enable signal and is input sequentially using the Write Enable signal.
of the timings requirements.
相关PDF资料 |
PDF描述 |
|---|---|
| NAND512W3A0AN1T | 64M X 8 FLASH 3V PROM, 35 ns, PDSO48 |
| NAND512W3A0AN6T | 64M X 8 FLASH 3V PROM, 35 ns, PDSO48 |
| NAND512W3A0BZB1E | 64M X 8 FLASH 3V PROM, 35 ns, PBGA55 |
| NAND512W3A2AZB1E | 64M X 8 FLASH 3V PROM, 35 ns, PBGA55 |
| NAND01GW3A3AZA1T | 128M X 8 FLASH 3V PROM, 12000 ns, PBGA63 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| NAND256W3A0AZA6E | 制造商:Micron Technology Inc 功能描述:FLASH PARALLEL 2.7V TO 3.6V 256MBIT 32MX8 12US 55VFBGA - Trays |
| NAND256W3A0AZA6F | 制造商:Micron Technology Inc 功能描述:FLASH PARALLEL 2.7V TO 3.6V 256MBIT 32MX8 12US 55VFBGA - Tape and Reel |
| NAND256W3A0BE06 | 功能描述:闪存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| NAND256W3A0BN6E | 制造商:Micron Technology Inc 功能描述:NAND - Trays |
| NAND256W3A0BN6F | 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel |
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