参数资料
型号: NAND256W3A0AN6F
厂商: NUMONYX
元件分类: PROM
英文描述: 32M X 8 FLASH 3V PROM, 35 ns, PDSO48
封装: 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48
文件页数: 8/58页
文件大小: 1406K
代理商: NAND256W3A0AN6F
Signal descriptions
NAND128-A, NAND256-A
3.6
Read Enable (R)
Read Enable, R, controls the sequential data output during read operations. Data is valid
tRLQV after the falling edge of R. The falling edge of R also increments the internal column
address counter by one.
3.7
Write Enable (W)
The Write Enable input, W, controls writing to the Command Interface, Input Address and
Data latches. Both addresses and data are latched on the rising edge of Write Enable.
During power-up and power-down a recovery time of 10 s (min) is required before the
Command Interface is ready to accept a command. It is recommended to keep Write Enable
high during the recovery time.
3.8
Write Protect (WP)
The Write Protect pin is an input that provides hardware protection against unwanted
program or erase operations. When Write Protect is Low, VIL, the device does not accept
any program or erase operations.
It is recommended to keep the Write Protect pin Low, VIL, during power-up and power-down.
3.9
Ready/Busy (RB)
The Ready/Busy output, RB, is an open-drain output that can be used to identify if the P/E/R
controller is currently active.
When Ready/Busy is Low, VOL, a read, program or erase operation is in progress. When the
operation completes Ready/Busy goes High, VOH.
The use of an open-drain output allows the Ready/Busy pins from several memories to be
connected to a single pull-up resistor. A Low then indicates that one or more of the
memories is busy.
calculate the value of the pull-up resistor.
3.10
VDD supply voltage
VDD provides the power supply to the internal core of the memory device. It is the main
power supply for all operations (read, program and erase).
An internal voltage detector disables all functions whenever VDD is below the VLKO threshold
(see paragraph Figure 35: Data protection) to protect the device from any involuntary
program/erase operations during power-transitions.
Each device in a system should have VDD decoupled with a 0.1 F capacitor. The PCB track
widths should be sufficient to carry the required program and erase currents
相关PDF资料
PDF描述
NAND512W3A0AN1T 64M X 8 FLASH 3V PROM, 35 ns, PDSO48
NAND512W3A0AN6T 64M X 8 FLASH 3V PROM, 35 ns, PDSO48
NAND512W3A0BZB1E 64M X 8 FLASH 3V PROM, 35 ns, PBGA55
NAND512W3A2AZB1E 64M X 8 FLASH 3V PROM, 35 ns, PBGA55
NAND01GW3A3AZA1T 128M X 8 FLASH 3V PROM, 12000 ns, PBGA63
相关代理商/技术参数
参数描述
NAND256W3A0AZA6E 制造商:Micron Technology Inc 功能描述:FLASH PARALLEL 2.7V TO 3.6V 256MBIT 32MX8 12US 55VFBGA - Trays
NAND256W3A0AZA6F 制造商:Micron Technology Inc 功能描述:FLASH PARALLEL 2.7V TO 3.6V 256MBIT 32MX8 12US 55VFBGA - Tape and Reel
NAND256W3A0BE06 功能描述:闪存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel
NAND256W3A0BN6E 制造商:Micron Technology Inc 功能描述:NAND - Trays
NAND256W3A0BN6F 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel