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参数资料
| 型号： | NAND256W3A0AN6F |
| 厂商： | NUMONYX |
| 元件分类： | PROM |
| 英文描述： | 32M X 8 FLASH 3V PROM, 35 ns, PDSO48 |
| 封装： | 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48 |
| 文件页数： | 50/58页 |
| 文件大小： | 1406K |
| 代理商： | NAND256W3A0AN6F |
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Hardware interface examples
NAND128-A, NAND256-A
Appendix A
Hardware interface examples
NAND flash devices can be connected to a microcontroller system bus for code and data
storage. For microcontrollers that have an embedded NAND controller the NAND flash can
be connected without the addition of glue logic (see Figure 38). However, a minimum of glue
logic is required for general purpose microcontrollers that do not have an embedded NAND
controller. The glue logic usually consists of a flip-flop to hold the Chip Enable, Address
Latch Enable, and Command Latch Enable signals stable during command and address
latch operations, and some logic gates to simplify the firmware or make the design more
robust.
Figure 39 provides an example of how to connect a NAND flash to a general purpose
microcontroller. The additional OR gates allow the microcontroller’s Output Enable and
Write Enable signals to be used for other peripherals. The OR gate between A3 and CSn
maps the flip-flop and NAND I/O in different address spaces inside the same chip select
unit, which improves the setup and hold times and simplifies the firmware. The structure
uses the microcontroller DMA (direct memory access) engines to optimize the transfer
between the NAND flash and the system RAM.
For any interface with glue logic, the extra delay caused by the gates and flip-flop must be
taken into account. This delay must be added to the microcontroller’s AC characteristics and
register settings to get the NAND flash setup and hold times.
For mass storage applications (hard disk emulations or systems where a huge amount of
storage is required) NAND flash memories can be connected together to build storage
modules (see Figure 40).
Figure 38.
Connection to microcontroller, without glue logic
AI08045b
R
W
I/O
E
AL
CL
W
G
CSn
AD(24:16)
Microcontroller
NAND
Flash
DQ
WP
RB
PWAITEN
AD17
AD16
VDD
VDD or VSS
or General Purpose I/O
相关PDF资料 |
PDF描述 |
|---|---|
| NAND512W3A0AN1T | 64M X 8 FLASH 3V PROM, 35 ns, PDSO48 |
| NAND512W3A0AN6T | 64M X 8 FLASH 3V PROM, 35 ns, PDSO48 |
| NAND512W3A0BZB1E | 64M X 8 FLASH 3V PROM, 35 ns, PBGA55 |
| NAND512W3A2AZB1E | 64M X 8 FLASH 3V PROM, 35 ns, PBGA55 |
| NAND01GW3A3AZA1T | 128M X 8 FLASH 3V PROM, 12000 ns, PBGA63 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| NAND256W3A0AZA6E | 制造商:Micron Technology Inc 功能描述:FLASH PARALLEL 2.7V TO 3.6V 256MBIT 32MX8 12US 55VFBGA - Trays |
| NAND256W3A0AZA6F | 制造商:Micron Technology Inc 功能描述:FLASH PARALLEL 2.7V TO 3.6V 256MBIT 32MX8 12US 55VFBGA - Tape and Reel |
| NAND256W3A0BE06 | 功能描述:闪存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| NAND256W3A0BN6E | 制造商:Micron Technology Inc 功能描述:NAND - Trays |
| NAND256W3A0BN6F | 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel |
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