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参数资料
| 型号： | RTPXA270C0C312 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 312 MHz, RISC PROCESSOR, PBGA356 |
| 封装： | 13 X 13 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VFBGA-356 |
| 文件页数： | 15/128页 |
| 文件大小： | 1560K |
| 代理商： | RTPXA270C0C312 |
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Electrical, Mechanical, and Thermal Specification
Glossary-1
Glossary
3G: An industry term used to describe the next, still-to-come generation of wireless applications. It represents a
move from circuit-switched communications (where a device user has to dial in to a network) to broadband,
high-speed, packet-based wireless networks (which are always on). The first generation of wireless
communications relied on analog technology, followed by digital wireless communications. The third generation
expands the digital capabilities by including high-speed connections and increased reliability.
802.11: Wireless specifications developed by the IEEE, outlining the means to manage packet traffic over a
network and ensure that packets do not collide, which could result in the loss of data, when travelling from device
to device.
8PSK: 8 phase shift key modulation scheme. Used in the EDGE standard.
AC ’97 AC-link standard serial interface for modem and audio
ACK: Handshake packet indicating a positive acknowledgment.
Active device: A device that is powered and is not in the suspended state.
Air interface: the RF interface between a mobile cellular handset and the base station
AMPS: Advanced Mobile Phone Service. A term used for analog technologies, the first generation of wireless
technologies.
Analog: Radio signals that are converted into a format that allows them to carry data. Cellular phones and other
wireless devices use analog in geographic areas with insufficient digital networks.
ARM* V5te: An ARM* architecture designation indicating the processor is conforms to ARM* architecture
version 5, including “Thumb” mode and the “El Segundo” DSP extensions.
Asynchronous Data: Data transferred at irregular intervals with relaxed latency requirements.
Asynchronous RA: The incoming data rate, Fs i, and the outgoing data rate, Fs o, of the RA process are
independent (i.e., there is no shared master clock). See also rate adaptation.
Asynchronous SRC: The incoming sample rate, Fsi, and outgoing sample rate, Fso, of the SRC process are
independent (i.e., there is no shared master clock). See also sample rate conversion.
Audio device: A device that sources or sinks sampled analog data.
AWG#: The measurement of a wire’s cross-section, as defined by the American Wire Gauge standard.
Babble: Unexpected bus activity that persists beyond a specified point in a (micro)frame.
Backlight Inverter: A device to drive cold cathode fluorescent lamps used to illuminate LCD panels.
Bandwidth: The amount of data transmitted per unit of time, typically bits per second (b/s) or bytes per second
(B/s). The size of a network “pipe” or channel for communications in wired networks. In wireless, it refers to the
range of available frequencies that carry a signal.
Base Station:The telephone company’s interface to the Mobile Station
相关PDF资料 |
PDF描述 |
|---|---|
| RCPXA270C0C520 | 520 MHz, MICROPROCESSOR, PBGA356 |
| RV5C387A-F | 0 TIMER(S), REAL TIME CLOCK, PDSO10 |
| RX-4571LC | REAL TIME CLOCK, PDSO12 |
| RX-4571SA | REAL TIME CLOCK, PDSO14 |
| RX-4571SA | 0 TIMER(S), REAL TIME CLOCK, PDSO14 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| RTPXA270C0C416 | 制造商:Intel 功能描述:MPU PXA270 416MHz 3V/3.3V 356-Pin VFBGA |
| RTPXA270C0C624 | 制造商:Intel 功能描述:MPU PXA270 624MHz 3V/3.3V 356-Pin VFBGA |
| RTPXA270C5C208 S L977 | 制造商:Marvell 功能描述:Marvell RTPXA270C5C208 S L977 Microprocessors |
| RTPXA270C5C312 | 功能描述:IC MPU 32BIT 312MHZ 356-PBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:1 系列:MPC85xx 处理器类型:32-位 MPC85xx PowerQUICC III 特点:- 速度:1.2GHz 电压:1.1V 安装类型:表面贴装 封装/外壳:783-BBGA，FCBGA 供应商设备封装:783-FCPBGA（29x29） 包装:托盘 |
| RTPXA270C5C312 868403 | 制造商:Marvell 功能描述: |
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