参数资料
型号: RTPXA270C0C312
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 312 MHz, RISC PROCESSOR, PBGA356
封装: 13 X 13 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VFBGA-356
文件页数: 81/128页
文件大小: 1560K
代理商: RTPXA270C0C312
5-6
Electrical, Mechanical, and Thermal Specification
Intel PXA270 Processor
Electrical Specifications
5.2.1
Internal Power Domains
The external power supplies are used to generate several internal power domains, which are shown
in Table 5-5. Refer to the Power Manager / Internal Power Domain Block Diagram in the “Clocks
and Power” section of the Intel PXA27x Processor Family Developers Manual for more
information on internal power domains.
Table 5-5. Internally Generated Power Domain Descriptions
Table 5-6 shows the recommended core voltage specification for each of the lower power modes.
Table 5-6. Core Voltage Specifications For Lower Power Modes
5.3
Power-Consumption Specifications
Power consumption depends on the operating voltage and frequency, peripherals enabled, external
switching activity, and external loading and other factors.
Table 5-7 contains the power consumption information. There are three sets of data: Active Power
Consumption, Idle Power Consumption and Low Power Modes Power Consumption. Data was
taken at room temperature. For Active Power Consumption data, no peripherals are enabled except
for UART.
Name
Units
Generation
Tolerance
VCC_REG
IO associated with deep-sleep-
active units
Switched between VCC_BATT and VCC_IO
-
VCC_OSC
Oscillator power supplies
Generated from VCC_REG
+/- 30%
VCC_RTC
RTC and power manager
supply
Switched between VCC_OSC and
VCC_CORE
-
VCC_PI
Power manager I2C supply
Switched between VCC_OSC and
VCC_CORE
-
VCC_CPU
CPU core
Independent power-down from VCC_CORE
-
VCC_PER
Peripheral units
Independent power-down from VCC_CORE
-
VCC_Rx
Particular internal SRAM unit
Switched between VCC_OSC and
VCC_SRAM
-
Mode
Description
Min
Typical
Max
Units
Standby
Voltage applied on VCC_CORE
1.045
1.1
1.21
V
Deep-Idle
Voltage applied on VCC_CORE
0.8075
0.85
0.935
V
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