参数资料
型号: TMS320F241PGS
厂商: TEXAS INSTRUMENTS INC
元件分类: 数字信号处理
英文描述: 0-BIT, 5 MHz, OTHER DSP, PQFP64
封装: PLASTIC, QFP-64
文件页数: 94/122页
文件大小: 1465K
代理商: TMS320F241PGS
TMS320F243, TMS320F241
DSP CONTROLLERS
SPRS064D DECEMBER 1997 REVISED FEBRUARY 2006
73
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
device and development-support tool nomenclature (continued)
Support tool development evolutionary flow:
TMDX
Development support product that has not yet completed Texas Instruments internal qualification
testing
TMDS
Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability
of the device have been demonstrated fully. TI’s standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, FN, PG, and PGE) and temperature range (for example, L). Figure 16 provides a legend for
reading the complete device name for any TMS320x2xx family member.
PREFIX
TEMPERATURE RANGE (DEFAULT: 0
°C TO 70°C)
TMS 320
F
243
PGE (L)
TMX = experimental device
TMP = prototype device
TMS = qualified device
DEVICE FAMILY
320 = TMS320
t DSP Family
TECHNOLOGY
L= 0
°C to 70°C
A= 40
°C to 85°C
S= 40
°C to 125°C
PACKAGE TYPE
FN = 68-pin PLCC
PG = 64-pin plastic QFP
PGE = 144-pin plastic LQFP
C = CMOS
E = CMOS EPROM
F = Flash EEPROM
LC = Low-voltage CMOS (3.3 V)
VC = Low-voltage CMOS (3 V)
DEVICE
24x DSP
240
241
242
243
PLCC = Plastic J-Leaded Chip Carrier
QFP
=
Quad Flatpack
LQFP =
Low-Profile Quad Flatpack
The package dimensions of the 243 device correspond to the LQFP package. This device was stated to be in QFP packaging
in previous data sheets. The package dimensions have not changed; only the package designation has changed.
Figure 16. TMS320x24x DSP Device Nomenclature
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