参数资料
型号: W25Q16DWSSIG
厂商: Winbond Electronics
文件页数: 18/85页
文件大小: 0K
描述: IC FLASH SPI 16MBIT 8SOIC
标准包装: 90
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 16M(2M x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 1.65 V ~ 1.95 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.209",5.30mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
W25Q16DW
7.1.12
W25Q16DW Status Register Memory Protection (CMP = 1)
STATUS REGISTER (1)
W25Q16DW (16M-BIT) MEMORY PROTECTION (3)
SEC
X
0
0
0
0
0
0
0
0
0
0
X
1
1
1
1
1
1
1
1
TB
X
0
0
0
0
0
1
1
1
1
1
X
0
0
0
0
1
1
1
1
BP2
0
0
0
0
1
1
0
0
0
1
1
1
0
0
0
1
0
0
0
1
BP1
0
0
1
1
0
0
0
1
1
0
0
1
0
1
1
0
0
1
1
0
BP0
0
1
0
1
0
1
1
0
1
0
1
X
1
0
1
X
1
0
1
X
PROTECTED
BLOCK(S)
0 thru 31
0 thru 30
0 thru 29
0 thru 27
0 thru 23
0 thru 15
1 thru 31
2 and 31
4 thru 31
8 thru 31
16 thru 31
NONE
0 thru 31
0 thru 31
0 thru 31
0 thru 31
0 thru 31
0 thru 31
0 thru 31
0 thru 31
PROTECTED
ADDRESSES
000000h – 1FFFFFh
000000h – 1EFFFFh
000000h – 1DFFFFh
000000h – 1BFFFFh
000000h – 17FFFFh
000000h – 0FFFFFh
010000h – 1FFFFFh
020000h – 1FFFFFh
040000h – 1FFFFFh
080000h – 1FFFFFh
100000h – 1FFFFFh
NONE
000000h – 1FEFFFh
000000h – 1FDFFFh
000000h – 1FBFFFh
000000h – 1F7FFFh
001000h – 1FFFFFh
002000h – 1FFFFFh
004000h – 1FFFFFh
008000h – 1FFFFFh
PROTECTED
DENSITY
ALL
1,984KB
1,920KB
1,792KB
1,536KB
1MB
1,984KB
1,920KB
1,792KB
1,536KB
1MB
NONE
2,044KB
2,040KB
2,032KB
2,016KB
2,044KB
2,040KB
2,032KB
2,016KB
PROTECTED
PORTION (2)
ALL
Lower 31/32
Lower 15/16
Lower 7/8
Lower 3/4
Lower 1/2
Upper 31/32
Upper 15/16
Upper 7/8
Upper 3/4
Upper 1/2
NONE
L – 511/512
L – 255/256
L – 127/128
L – 63/64
U – 511/512
U – 255/256
U – 127/128
U – 63/64
Note:
1. X = don’t care
2. L = Lower; U = Upper
3. If any Erase or Program command specifies a memory region that contains protected data portion, this
command will be ignored.
- 18 -
相关PDF资料
PDF描述
W9816G6IH-6 IC SDRAM 16MBIT 50TSOPII
AX1000-1FG896 IC FPGA AXCELERATOR 1M 896-FBGA
AX1000-FGG896I IC FPGA AXCELERATOR 1M 896-FBGA
AX1000-1FGG896 IC FPGA AXCELERATOR 1M 896-FBGA
W25Q16CVZPIG IC SPI FLASH 16MBIT 8WSON
相关代理商/技术参数
参数描述
W25Q16DWSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q16DWZPIG 制造商:Winbond Electronics Corp 功能描述:IC FLASH 16MBIT 104MHZ 8WSON
W25Q16DWZPIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q16V 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16VSFIG 功能描述:IC FLASH 16MBIT 80MHZ 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步,DDR II 存储容量:18M(1M x 18) 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA(13x15) 包装:托盘 其它名称:71P71804S200BQ