参数资料
| 型号： | W25Q16DWSSIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 3/85页 |
| 文件大小： | 0K |
| 描述： | IC FLASH SPI 16MBIT 8SOIC |
| 标准包装： | 90 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 16M（2M x 8） |
| 速度： | 104MHz |
| 接口： | SPI 串行 |
| 电源电压： | 1.65 V ~ 1.95 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.209"，5.30mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
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W25Q16DW
7.1.11
7.1.12
W25Q16DW Status Register Memory Protection (CMP = 0) ............................................. 17
W25Q16DW Status Register Memory Protection (CMP = 1) ............................................. 18
7.2
INSTRUCTIONS................................................................................................................. 19
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.2.6
7.2.7
7.2.8
7.2.9
7.2.10
7.2.11
7.2.12
7.2.13
7.2.14
7.2.15
7.2.16
7.2.17
7.2.18
7.2.19
7.2.20
7.2.21
7.2.22
7.2.23
7.2.24
7.2.25
7.2.26
7.2.27
7.2.28
7.2.29
7.2.30
7.2.31
7.2.32
7.2.33
7.2.34
7.2.35
7.2.36
7.2.37
7.2.38
7.2.39
7.2.40
Manufacturer and Device Identification ................................................................................ 19
Instruction Set Table 1 (Standard SPI Instructions) ............................................................. 20
Instruction Set Table 2 (Dual SPI Instructions) ..................................................................... 21
Instruction Set Table 3 (Quad SPI Instructions) ................................................................... 21
Instruction Set Table 4 (QPI Instructions) ............................................................................. 22
Write Enable (06h) ............................................................................................................... 24
Write Enable for Volatile Status Register (50h) .................................................................... 24
Write Disable (04h)............................................................................................................... 24
Read Status Register-1 (05h) and Read Status Register-2 (35h) ........................................ 25
Write Status Register (01h) ................................................................................................ 26
Read Data (03h) ................................................................................................................. 28
Fast Read (0Bh) ................................................................................................................. 29
Fast Read Dual Output (3Bh) ............................................................................................. 31
Fast Read Quad Output (6Bh) ............................................................................................ 32
Fast Read Dual I/O (BBh) ................................................................................................... 33
Fast Read Quad I/O (EBh) ................................................................................................. 35
Word Read Quad I/O (E7h) ................................................................................................ 38
Octal Word Read Quad I/O (E3h)....................................................................................... 40
Set Burst with Wrap (77h) .................................................................................................. 42
Page Program (02h) ........................................................................................................... 43
Quad Input Page Program (32h) ........................................................................................ 45
Sector Erase (20h) ............................................................................................................. 46
32KB Block Erase (52h) ..................................................................................................... 47
64KB Block Erase (D8h) ..................................................................................................... 48
Chip Erase (C7h / 60h) ....................................................................................................... 49
Erase / Program Suspend (75h) ......................................................................................... 50
Erase / Program Resume (7Ah) ......................................................................................... 52
Power-down (B9h) .............................................................................................................. 53
Release Power-down / Device ID (ABh) ............................................................................. 54
Read Manufacturer / Device ID (90h) ................................................................................. 56
Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 57
Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 58
Read Unique ID Number (4Bh)........................................................................................... 59
Read JEDEC ID (9Fh) ........................................................................................................ 60
Erase Security Registers (44h) ........................................................................................... 61
Program Security Registers (42h) ...................................................................................... 62
Read Security Registers (48h) ........................................................................................... 63
Set Read Parameters (C0h) ............................................................................................... 64
Burst Read with Wrap (0Ch)............................................................................................... 65
Enable QPI (38h) ................................................................................................................ 66
Publication Release Date: September 06, 2012
-3-
Revision F
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相关代理商/技术参数 |
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| W25Q16DWSSIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q16DWZPIG | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 16MBIT 104MHZ 8WSON |
| W25Q16DWZPIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
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| W25Q16VSFIG | 功能描述:IC FLASH 16MBIT 80MHZ 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步，DDR II 存储容量:18M（1M x 18） 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA（13x15） 包装:托盘 其它名称:71P71804S200BQ |
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