参数资料
型号: W25Q16DWSSIG
厂商: Winbond Electronics
文件页数: 68/85页
文件大小: 0K
描述: IC FLASH SPI 16MBIT 8SOIC
标准包装: 90
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 16M(2M x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 1.65 V ~ 1.95 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.209",5.30mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
W25Q16DW
7.2.42
Enable Reset (66h) and Reset (99h)
Because of the small package and the limitation on the number of pins, the W25Q16DW provide a
software Reset instruction instead of a dedicated RESET pin. Once the Reset instruction is accepted, any
on-going internal operations will be terminated and the device will return to its default power-on state and
lose all the current volatile settings, such as Volatile Status Register bits, Write Enable Latch (WEL)
status, Program/Erase Suspend status, Read parameter setting (P7-P0), Continuous Read Mode bit
setting (M7-M0) and Wrap Bit setting (W6-W4).
“Enable Reset (66h)” and “Reset (99h)” instructions can be issued in either SPI mode or QPI mode. To
avoid accidental reset, both instructions must be issued in sequence. Any other commands other than
“Reset (99h)” after the “Enable Reset (66h)” command will disable the “Reset Enable” state. A new
sequence of “Enable Reset (66h)” and “Reset (99h)” is needed to reset the device. Once the Reset
command is accepted by the device, the device will take approximately tRST=30us to reset. During this
period, no command will be accepted.
Data corruption may happen if there is an on-going or suspended internal Erase or Program operation
when Reset command sequence is accepted by the device. It is recommended to check the BUSY bit and
the SUS bit in Status Register before issuing the Reset command sequence.
/CS
Mode 3
0
1
2
3
4
5
6
7
Mode 3
0
1
2
3
4
5
6
7
Mode 3
CLK
Mode 0
Instruction (66h)
Mode 0
Instruction (99h)
Mode 0
DI
(IO 0 )
DO
High Impedance
(IO 1 )
Figure 41a. Enable Reset and Reset Instruction Sequence (SPI Mode)
/CS
Mode 3
0
1
Mode 3
0
1
Mode 3
CLK
Mode 0
I nstructio n
66h
Mode 0
In structio n
99h
Mode 0
IO 0
IO 1
IO 2
IO 3
Figure 41b. Enable Reset and Reset Instruction Sequence (QPI Mode)
- 68 -
相关PDF资料
PDF描述
W9816G6IH-6 IC SDRAM 16MBIT 50TSOPII
AX1000-1FG896 IC FPGA AXCELERATOR 1M 896-FBGA
AX1000-FGG896I IC FPGA AXCELERATOR 1M 896-FBGA
AX1000-1FGG896 IC FPGA AXCELERATOR 1M 896-FBGA
W25Q16CVZPIG IC SPI FLASH 16MBIT 8WSON
相关代理商/技术参数
参数描述
W25Q16DWSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q16DWZPIG 制造商:Winbond Electronics Corp 功能描述:IC FLASH 16MBIT 104MHZ 8WSON
W25Q16DWZPIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q16V 制造商:WINBOND 制造商全称:Winbond 功能描述:16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16VSFIG 功能描述:IC FLASH 16MBIT 80MHZ 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步,DDR II 存储容量:18M(1M x 18) 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA(13x15) 包装:托盘 其它名称:71P71804S200BQ