参数资料
| 型号： | XRT75R12DIB-L |
| 厂商： | Exar Corporation |
| 文件页数： | 57/133页 |
| 文件大小： | 0K |
| 描述： | IC LIU E3/DS3/STS-1 12CH 420TBGA |
| 标准包装： | 40 |
| 类型： | 线路接口装置（LIU） |
| 驱动器/接收器数： | 12/12 |
| 规程： | DS3，E3，STS-1 |
| 电源电压： | 3.135 V ~ 3.465 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 420-LBGA 裸露焊盘 |
| 供应商设备封装： | 420-TBGA（35x35） |
| 包装： | 托盘 |
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XRT75R12D
I
REV. 1.0.3
TWELVE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH SONET DESYNCHRONIZER
TABLE OF CONTENTS
GENERAL DESCRIPTION.............................................................................................................. 1
APPLICATIONS ............................................................................................................................................................... 1
FIGURE 1. BLOCK DIAGRAM OF THE XRT 75R12D.................................................................................................................................. 1
ORDERING INFORMATION .................................................................................................................... 1
FEATURES..................................................................................................................................................................... 2
TRANSMIT INTERFACE CHARACTERISTICS ....................................................................................................................... 2
RECEIVE INTERFACE CHARACTERISTICS ......................................................................................................................... 2
PIN DESCRIPTIONS (BY FUNCTION) ........................................................................................... 3
SYSTEM-SIDE TRANSMIT INPUT AND TRANSMIT CONTROL PINS....................................................................................... 3
SYSTEM-SIDE RECEIVE OUTPUT AND RECEIVE CONTROL PINS ....................................................................................... 6
RECEIVE LINE SIDE PINS ............................................................................................................................................... 8
CLOCK INTERFACE......................................................................................................................................................... 9
GENERAL CONTROL PINS ............................................................................................................................................ 10
POWER SUPPLY PINS .................................................................................................................................................. 12
GROUND PINS ............................................................................................................................................................. 13
TABLE 1: LIST BY PIN NUMBER ............................................................................................................................................................. 14
FUNCTIONAL DESCRIPTION ...................................................................................................... 18
1.0 R3 TECHNOLOGY (RECONFIGURABLE, RELAYLESS REDUNDANCY) ....................................... 18
1.1 NETWORK ARCHITECTURE ......................................................................................................................... 18
FIGURE 2. NETWORK REDUNDANCY ARCHITECTURE .............................................................................................................................. 18
2.0 CLOCK SYNTHESIZER ....................................................................................................................... 19
FIGURE 3. SIMPLIFIED BLOCK DIAGRAM OF THE INPUT CLOCK CIRCUITRY DRIVING THE MICROPROCESSOR ............................................ 19
TABLE 2: REFERENCE CLOCK PERFORMANCE SPECIFICATIONS.............................................................................................................. 19
2.1 CLOCK DISTRIBUTION ................................................................................................................................. 20
FIGURE 4. CLOCK DISTRIBUTION CONGIFURED IN E3 MODE WITHOUT USING SFM ................................................................................ 20
3.0 THE RECEIVER SECTION .................................................................................................................. 21
FIGURE 5. RECEIVE PATH BLOCK DIAGRAM .......................................................................................................................................... 21
3.1 RECEIVE LINE INTERFACE .......................................................................................................................... 21
FIGURE 6. RECEIVE LINE INTERFACECONNECTION................................................................................................................................. 21
3.2 ADAPTIVE GAIN CONTROL (AGC) .............................................................................................................. 21
3.3 RECEIVE EQUALIZER ................................................................................................................................... 22
FIGURE 7. ACG/EQUALIZER BLOCK DIAGRAM ....................................................................................................................................... 22
3.3.1 RECOMMENDATIONS FOR EQUALIZER SETTINGS .............................................................................................. 22
3.4 CLOCK AND DATA RECOVERY ................................................................................................................... 22
3.4.1 DATA/CLOCK RECOVERY MODE ............................................................................................................................ 22
3.4.2 TRAINING MODE........................................................................................................................................................ 22
3.5 LOS (LOSS OF SIGNAL) DETECTOR ........................................................................................................... 23
3.5.1 DS3/STS-1 LOS CONDITION ..................................................................................................................................... 23
TABLE 3: THE ALOS (ANALOG LOS) DECLARATION AND CLEARANCE THRESHOLDS FOR A GIVEN SETTING OF REQEN (DS3 AND STS-1 AP-
PLICATIONS
).......................................................................................................................................................................... 23
3.5.2 DISABLING ALOS/DLOS DETECTION ..................................................................................................................... 23
3.5.3 E3 LOS CONDITION:.................................................................................................................................................. 23
FIGURE 8. LOSS OF SIGNAL DEFINITION FOR E3 AS PER ITU-T G.775 .................................................................................................. 23
FIGURE 9. LOSS OF SIGNAL DEFINITION FOR E3 AS PER ITU-T G.775................................................................................................... 24
3.5.4 INTERFERENCE TOLERANCE.................................................................................................................................. 24
FIGURE 10. INTERFERENCE MARGIN TEST SET UP FOR DS3/STS-1 ...................................................................................................... 24
FIGURE 11. INTERFERENCE MARGIN TEST SET UP FOR E3. ................................................................................................................... 24
TABLE 4: INTERFERENCE MARGIN TEST RESULTS ................................................................................................................................. 25
3.5.5 MUTING THE RECOVERED DATA WITH LOS CONDITION:................................................................................... 26
FIGURE 12. RECEIVER DATA OUTPUT AND CODE VIOLATION TIMING ........................................................................................................ 26
3.6 B3ZS/HDB3 DECODER .................................................................................................................................. 26
4.0 JITTER ................................................................................................................................................. 27
4.1 JITTER TOLERANCE ..................................................................................................................................... 27
FIGURE 13. JITTER TOLERANCE MEASUREMENTS .................................................................................................................................. 27
4.1.1 DS3/STS-1 JITTER TOLERANCE REQUIREMENTS ................................................................................................ 27
FIGURE 14. INPUT JITTER TOLERANCE FOR DS3/STS-1 ...................................................................................................................... 28
4.1.2 E3 JITTER TOLERANCE REQUIREMENTS.............................................................................................................. 28
FIGURE 15. INPUT JITTER TOLERANCE FOR E3 .................................................................................................................................... 28
TABLE 5: JITTER AMPLITUDE VERSUS MODULATION FREQUENCY (JITTER TOLERANCE) ........................................................................... 29
4.2 JITTER TRANSFER ........................................................................................................................................ 29
相关PDF资料 |
PDF描述 |
|---|---|
| XRT75R12IB-L | IC LIU E3/DS3/STS-1 12CH 420TBGA |
| XRT75VL00DIV | IC LIU E3/DS3/STS-1 1CH 52TQFP |
| XRT75VL00IV-F | IC LIU E3/DS3/STS-1 1CH 52TQFP |
| XRT79L71IB-F | IC LIU/FRAMER DS3/E3 1CH 208BGA |
| XRT81L27IV-F | IC LIU EI 7CH 3.3V 128TQFP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XRT75R12ES | 功能描述:时钟合成器/抖动清除器 12CH T3/E3/STS1LIUJA 3.3V W/REDUNDANCY RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
| XRT75R12IB | 功能描述:外围驱动器与原件 - PCI 12CH E3/DS3/STS W/JITTER R3 TECH RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray |
| XRT75R12IB-F | 功能描述:外围驱动器与原件 - PCI 12 Channel 3.3V-5V temp -45 to 85C RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray |
| XRT75R12IB-L | 功能描述:LIN 收发器 Attenuator RoHS:否 制造商:NXP Semiconductors 工作电源电压: 电源电流: 最大工作温度: 封装 / 箱体:SO-8 |
| XRT75VL00 | 制造商:EXAR 制造商全称:EXAR 功能描述:E3/DS3/STS-1 LINE INTERFACE UNIT WITH JITTER ATTENUATOR |
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