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| 型号： | IDT72T6360L6BBGI |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | SPECIALTY MICROPROCESSOR CIRCUIT, PBGA324 |
| 封装： | 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 |
| 文件页数： | 4/51页 |
| 文件大小： | 508K |
| 代理商： | IDT72T6360L6BBGI |
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12
IDT72T6360 2.5V, SEQUENTIAL FLOW-CONTROL DEVICE
x9, x18, x36 BIT WIDE CONFIGURATION
COMMERCIALANDINDUSTRIAL
TEMPERATURERANGES
OCTOBER 10, 2005
EXTERNAL MEMORY CONFIGURATIONS
The DDR SDRAM interface of the sequential flow-control (SFC) device has
a 64-bit output data bus that provides up to four (16-bit SDRAM) external DDR
SDRAM connections. For multiple memory connections, they must be of the
same density configuration and speed grade. For example, two device
connected cannot consist of one 128Mb and one 256Mb memory nor two
128Mb with one at 133MHz and the other at 166MHz. Below is a summary of
thepossibleconfigurations:
One 16-bit device connecting a x16 interface to the DDR SDRAM
One 32-bit device connecting a x32 interface to the DDR SDRAM
Two 16-bit devices connecting a x32 interface to the DDR SDRAM
Two 32-bit devices connecting a x36 interface to the DDR SDRAM
Two 32-bit devices connecting a x64 interface to the DDR SDRAM
Three 16-bit devices connecting a x36 interface to the DDR SDRAM
Four 16-bit devices connecting a x64 interface to the DDR SDRAM
These various configurations determine the storage density of the SFC
device. Thestoragedensitycanrangefromaminimumof128Mbtoamaximum
of 1Gb. Table 3 lists the possible ways to connect the DDR SDRAMs and the
number of chipset solutions to obtain the various storage densities.
NOTES:
1. The chip solution number includes the sequential flow-control device and external DDR SDRAM
2. See Figure 2a-2g for the 7 different configurations referenced in the table above.
Two Chip Solution(1)
Three Chip Solution(1)
Four Chip Solution(1)
Five Chip Solution(1)
(2)Configuration 1, 2
(2)Configurations 3, 4, 5
(2)Configuration 6
(2)Configuration 7
1 x128Mb [4M x 32]
2 x 128Mb [4M x 32]
N/A
Total memory: 128Mb
Total memory: 256Mb
1 x 256Mb [8M x 32]
2 x 256Mb [8M x 32]
N/A
Total memory: 256Mb
Total memory: 512Mb
1 x 128Mb [8M x 16]
2 x 128Mb [8M x 16]
3 x 128Mb [8M x 16]
4 x 128Mb [8M x 16]
Total memory: 128Mb
Total memory: 256Mb
Total memory: 384Mb
Total memory: 512Mb
1 x 256Mb [16M x 16]
2 x 256Mb [16M x 16]
3 x 256Mb [16M x 16]
4 x 256Mb [16M x 16]
Total memory: 256Mb
Total memory: 512Mb
Total memory: 768Mb
Total memory: 1Gb
TABLE 3 – TOTAL POSSIBLE EXTERNAL MEMORY CONFIGURATIONS
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相关代理商/技术参数 |
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| IDT72T6360L7-5BB | 功能描述:IC FLOW-CTRL 48BIT 7-5NS 324-BGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA（27x27） 包装:散装 |
| IDT72T6360L7-5BBI | 功能描述:IC FLOW-CTRL 48BIT 7-5NS 324-BGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA（27x27） 包装:散装 |
| IDT72T6480L10BB | 功能描述:IC FLOW-CTRL 48BIT 10NS 324-BGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA（27x27） 包装:散装 |
| IDT72T6480L10BBI | 功能描述:IC FLOW-CTRL 48BIT 10NS 324-BGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA（27x27） 包装:散装 |
| IDT72T6480L7-5BB | 功能描述:IC FLOW-CTRL 48BIT 7-5NS 324-BGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA（27x27） 包装:散装 |
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