参数资料
型号: MT46V32M81AZ4-6T:G
元件分类: DRAM
英文描述: 32M X 4 DDR DRAM, 0.75 ns, PDSO66
封装: 0.400 INCH, PLASTIC, TSOP-66
文件页数: 81/82页
文件大小: 2866K
128Mb: x4, x8, x16
DDR SDRAM
09005aef8074a655
Micron Technology, Inc., reserves the right to change products or specifications without notice.
128MBDDRx4x8x16_2.fm - Rev. J 7/04 EN
82
2000 Micron Technology, Inc. All rights reserved.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
Figure 55: 60-Ball FBGA (16 x 9mm)
NOTE:
All dimensions are in millimeters.
Data Sheet Designation
This data sheet contains minimum and maximum
limits specified over the complete power supply and
temperature range for production devices. Although
considered final, these specifications are subject to
change, as further product development and data
characterization sometimes occur.
BALL #1 ID
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2% Ag
SOLDER BALL PAD: .33mm
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
BALL A1
BALL A1 ID
CL
0.850 ±0.075
0.10 C
C
.45
60X
SOLDER BALL DIAMETER REFERS TO
POST REFLOW CONDITION. THE
PRE-REFLOW DIAMETER IS 0.40mm.
BALL A9
11.00
5.50 ±0.05
8.00 ±0.05
16.00 ±0.10
1.00
TYP
0.80
TYP
6.40
3.20 ±0.05 4.50 ±0.05
9.00 ±0.10
1.20 MAX
SEATING PLANE
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