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参数资料
| 型号： | NAND01GW3B2AN6F |
| 厂商： | NUMONYX |
| 元件分类： | PROM |
| 英文描述： | 128M X 8 FLASH 3V PROM, 25000 ns, PDSO48 |
| 封装： | 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 |
| 文件页数： | 35/64页 |
| 文件大小： | 632K |
| 代理商： | NAND01GW3B2AN6F |
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Software algorithms
NAND01G-B, NAND02G-B
40/64
8
Software algorithms
This section gives information on the software algorithms that ST recommends to implement
to manage the Bad Blocks and extend the lifetime of the NAND device.
NAND Flash memories are programmed and erased by Fowler-Nordheim tunneling using a
high voltage. Exposing the device to a high voltage for extended periods can cause the
oxide layer to be damaged. For this reason, the number of program and erase cycles is
limited (see Table 18 for value) and it is recommended to implement Garbage Collection, a
Wear-Leveling Algorithm and an Error Correction Code, to extend the number of program
and erase cycles and increase the data retention.
To help integrate a NAND memory into an application ST Microelectronics can provide a File
System OS Native reference software, which supports the basic commands of file
management.
Contact the nearest ST Microelectronics sales office for more details.
8.1
Bad Block Management
Devices with Bad Blocks have the same quality level and the same AC and DC
characteristics as devices where all the blocks are valid. A Bad Block does not affect the
performance of valid blocks because it is isolated from the bit line and common source line
by a select transistor.
The devices are supplied with all the locations inside valid blocks erased (FFh). The Bad
Block Information is written prior to shipping. Any block, where the 1st and 6th Bytes, or 1st
Word, in the spare area of the 1st page, does not contain FFh, is a Bad Block.
The Bad Block Information must be read before any erase is attempted as the Bad Block
Information may be erased. For the system to be able to recognize the Bad Blocks based on
the original information it is recommended to create a Bad Block table following the
flowchart shown in Figure 19
8.2
Block Replacement
Over the lifetime of the device additional Bad Blocks may develop. In this case the block has
to be replaced by copying the data to a valid block. These additional Bad Blocks can be
identified as attempts to program or erase them will give errors in the Status Register.
As the failure of a page program operation does not affect the data in other pages in the
same block, the block can be replaced by re-programming the current data and copying the
rest of the replaced block to an available valid block. The Copy Back Program command can
be used to copy the data to a valid block.
See the Section 6.4: Copy Back Program for more details.
Refer to Table 17 for the recommended procedure to follow if an error occurs during an
operation.
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| NAND02GR4B2BZB1 | 128M X 16 FLASH 1.8V PROM, 35 ns, PBGA63 |
| NCH030A3-FREQ-OUT27 | CRYSTAL OSCILLATOR, CLOCK, 1 MHz - 4 MHz, HCMOS OUTPUT |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| NAND01GW3B2AN6T | 功能描述:闪存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| NAND01GW3B2AZA1 | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:1 Gbit, 2 Gbit, 2112 Byte/1056 Word Page, 1.8V/3V, NAND Flash Memory |
| NAND01GW3B2AZA6 | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:1 Gbit, 2 Gbit, 2112 Byte/1056 Word Page, 1.8V/3V, NAND Flash Memory |
| NAND01GW3B2AZA6E | 功能描述:闪存 NAND MEDIA FLASH RoHS:否 制造商:ON Semiconductor 数据总线宽度:1 bit 存储类型:Flash 存储容量:2 MB 结构:256 K x 8 定时类型: 接口类型:SPI 访问时间: 电源电压-最大:3.6 V 电源电压-最小:2.3 V 最大工作电流:15 mA 工作温度:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体: 封装:Reel |
| NAND01GW3B2AZA6F | 制造商:Micron Technology Inc 功能描述:FLASH PARALLEL 3.3V 1GBIT 128MX8 25US 63VFBGA - Tape and Reel |
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