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参数资料
型号： SFCF8192H4BK4SA-I-QT-553-SMA
厂商： Swissbit NA Inc
文件页数： 33/99页
文件大小： 0K
描述： FLASH SLC UDMA/MDMA/PIO 8G
视频文件： Swissbit Manufacturing Overview
RoHS指令信息： Environment Protection Declaration
标准包装： 20
系列： C-300
存储容量： 8GB
存储器类型： CompactFlash?
其它名称： 1052-1012
Table 28: Ultr a DMA Sender and Recipient IC Timing Requirements
Name
Comments
UDMA
Mode 0
(ns)
UDMA
Mode 1
(ns)
UDMA
Mode 2
(ns)
UDMA
Mode 3
(ns)
UDMA
Mode4
(ns)
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
t DSIC
Recipient IC data setup time (from
14.7
9.7
6.8
6.8
4.8
data valid until STROBE edge)
(see note 2)
t DHIC
Recipient IC data hold time (from
4.8
4.8
4.8
4.8
4.8
STROBE edge until data may
become invalid) (see note 2)
t DVSIC
Sender IC data valid setup time
72.9
50.9
33.9
22.6
9.5
(from data valid until STROBE
edge) (see note 3)
t DVHIC
Sender IC data valid hold time
9.0
9.0
9.0
9.0
9.0
(from STROBE edge until data
may become invalid) (see note 3)
Notes:
1.
2.
3.
All timing measurement switching points(low to high and high to low) shall be taken at 1.5 V.
The correct data value shall be captured by the recipient given input data with a slew rate of 0.4 V/ns rising and falling
and the input STROBE with a slew rate of 0.4 V/ns rising and falling at t DSIC and t DHIC timing (as measured through 1.5
V).
The parameters t DVSIC and t DVHIC shall be met for lumped capacitive loads of 15 and 40 pF at the IC where all signals
have the same capacitive load value. Noise that may couple onto the output signals from external sources has not been
included in these values.
Table 29: Ultr a DMA AC Signal Requirements
Name
Comment
Min
Max
Notes
[V/ns]
[V/ns]
S RISE
S FALL
Rising Edge Slew Rate for any signal
Falling Edge Slew Rate for any signal
1.25
1.25
1
1
Note:
1.
The sender shall be tested while driving an 18 inch long, 80 conductor cable with PVC insulation material. The signal
under test shall be cut at a test point so that it has not trace, cable or recipient loading after the test point. All other
signals should remain connected through to the recipient. The test point may be located at any point between the
sender’s series termination resistor and one half inch or less of conductor exiting the connector. If the test point is on
a cable conductor rather than the PCB, an adjacent ground conductor shall also be cut within one half inch of the
connector.
The test load and test points should then be soldered directly to the exposed source side connectors. The test loads
consist of a 15 pF or a 40 pF, 5%, 0.08 inch by 0.05 inch surface mount or smaller size capacitor from the test point to
ground. Slew rates shall be met for both capacitor values.
Measurements shall be taken at the test point using a <1 pF, >100 Kohm, 1 Ghz or faster probe and a 500 MHz or
faster oscilloscope. The average rate shall be measured from 20% to 80% of the settled VOH level with data
transitions at least 120 ns apart. The settled VOH level shall be measured as the average output high level under the
defined testing conditions from 100 nsec after 80% of a rising edge until 20% of the subsequent falling edge.
6.5.4.4.1 Initiating an Ultra DMA Data-In Burst
a) An Ultra DMA Data-In burst is initiated by following the steps lettered below. The timing diagram is
shown in Figure 10: Ultra DMA Data-In Burst Initiation Timing. The associated timing parameters are
specified in Table 26: Ultra DMA Data Burst Timing Requirements and are described in Table 27: Ultra DMA
Data Burst Timing Descriptions.
b) The following steps shall occur in the order they are listed unless otherwise specifically allowed:
c)
The host shall keep – DMACK in the negated state before an Ultra DMA burst is initiated.
d) The device shall assert DMARQ to initiate an Ultra DMA burst. After assertion of DMARQ the device shall not
negate DMARQ until after the first negation of DSTROBE.
e) Steps I, (d), and (e) may occur in any order or at the same time. The host shall assert STOP.
f)
The host shall negate – HDMARDY.
g) The host shall negate – CS0, -CS1, DA2, DA1, and DA0. The host shall keep – CS0, -CS1, DA2, DA1, and DA0
negated until after negating – DMACK at the end of the burst.
h) Steps I, (d), and (e) shall have occurred at least t ACK before the host asserts – DMACK. The host shall keep –
DMACK asserted until the end of an Ultra DMA burst.
i)
j)
The host shall release D[15:00] within t AZ after asserting – DMACK.
The device may assert DSTROBE t ZIORDY after the host has asserted – DMACK. Once the device has driven
DSTROBE the device shall not release DSTROBE until after the host has negated – DMACK at the end of an
Ultra DMA burst.
Swissbit AG
Industriestrasse 4
Swissbit reserves the right to change products or specifications without notice.
Revision: 1.51
CH-9552 Bronschhofen
Switzerland
www.swissbit.com
industrial@swissbit.com
C-300_data_sheet_CF-HxBK_Rev151.doc
Page 33 of 99
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