参数资料
型号: SPC5634MF1MMG80
厂商: Freescale Semiconductor
文件页数: 22/122页
文件大小: 0K
描述: IC MCU FLASH 1.5M 94K 208-PBGA
标准包装: 90
系列: MPC56xx Qorivva
核心处理器: e200z3
芯体尺寸: 32-位
速度: 80MHz
连通性: CAN,EBI/EMI,LIN,SCI,SPI,UART/USART
外围设备: DMA,POR,PWM,WDT
输入/输出数: 114
程序存储器容量: 1.5MB(1.5M x 8)
程序存储器类型: 闪存
RAM 容量: 94K x 8
电压 - 电源 (Vcc/Vdd): 4.5 V ~ 5.25 V
数据转换器: A/D 34x12b
振荡器型: 内部
工作温度: -40°C ~ 150°C
封装/外壳: 208-BGA
包装: 托盘
MPC5634M Microcontroller Data Sheet, Rev. 9
Document revision history
Freescale Semiconductor
118
Rev. 5
04/2010
Updates to features list:
MMU is 16-entry (previously noted as 8-entry)
ECSM features include single-bit error correction reporting
eTPU2 is object code compatible with previous eTPU versions
Updates to feature details:
Programming feature: eTPU2 channel flags can be tested
Pinout/ballmap changes:
144 pin LQFP package:
Pin 46 is now VDDEH1B (was VDDEH4A)
Pin 61 is now VDDEH6A (was VDDEH4B)
176 pin LQFP package (1.5M devices)
Pin 55 is now VDDEH1B (was VDDEH4A)
Pin 74 is now VDDEH6A (was VDDEH4B)
176 pin LQFP package (1.5M devices)
Pin 55 is now VDDEH1B (was VDDEH4A)
Pin 74 is now VDDEH6A (was VDDEH4B)
208 ball BGA package (all devices)
Ball N9 changed to VDDEH1/6 (was VDDEH6). In a future revision of the device this may
be changed to NC (no connect).
Changes to calibration ball names on devices with 1 MB flash memory:
CAL_MDO0 changed to ALT_MDO0
CAL_MDO1 changed to ALT_MDO1
CAL_MDO2 changed to ALT_MDO2
CAL_MDO3 changed to ALT_MDO3
CAL_MSEO0 changed to ALT_MSEO0
CAL_MSEO1 changed to ALT_MSEO1
CAL_EVTI changed to ALT_EVTI
CAL_EVTO changed to ALT_EVTO
CAL_MCKO changed to ALT_MCKO
Power/ground segment changes:
The following pins are on VDDE7 I/O segment only on the 208-ball BGA package:
ALT_MDO[0:3], ALT_MSEO[0:1], ALT_EVTI, ALT_EVTO, ALT_MCKO.
Power segments VDDEH4, VDDEH4A and VDDEH4B have been removed.
CLKOUT power segment is VDDE5 (was VDDE12)
Thermal characteristics for 176-pin LQFP updated (all parameter values)
Table 43. Revision history (continued)
Revision
Date
Description of Changes
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