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参数资料
| 型号： | SPC5634MF1MMG80 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 80/122页 |
| 文件大小： | 0K |
| 描述： | IC MCU FLASH 1.5M 94K 208-PBGA |
| 标准包装： | 90 |
| 系列： | MPC56xx Qorivva |
| 核心处理器： | e200z3 |
| 芯体尺寸： | 32-位 |
| 速度： | 80MHz |
| 连通性： | CAN，EBI/EMI，LIN，SCI，SPI，UART/USART |
| 外围设备： | DMA，POR，PWM，WDT |
| 输入/输出数： | 114 |
| 程序存储器容量： | 1.5MB（1.5M x 8） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 94K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 4.5 V ~ 5.25 V |
| 数据转换器： | A/D 34x12b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 150°C |
| 封装/外壳： | 208-BGA |
| 包装： | 托盘 |
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MPC5634M Microcontroller Data Sheet, Rev. 9
Electrical characteristics
Freescale Semiconductor
60
4.3.1
General notes for specifications at maximum junction temperature
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RJA * PD)
Eqn. 1
where:
TA = ambient temperature for the package (oC)
RJA = junction-to-ambient thermal resistance (oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide consistent values for
estimations and comparisons. The difference between the values determined for the single-layer (1s) board compared to a
four-layer board that has two signal layers, a power and a ground plane (2s2p), demonstrate that the effective thermal resistance
is not a constant. The thermal resistance depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to connect the package
to the planes reduces the thermal performance. Thinner planes also reduce the thermal performance. When the clearance
between the vias leave the planes virtually disconnected, the thermal performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly packed printed circuit
board. The value obtained on a board with the internal planes is usually within the normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding components. In addition, the
ambient temperature varies widely within the application. For many natural convection and especially closed box applications,
the board temperature at the perimeter (edge) of the package is approximately the same as the local air temperature near the
device. Specifying the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ = TB + (RJB * PD)
Eqn. 2
where:
TB = board temperature for the package perimeter (oC)
RJB = junction-to-board thermal resistance (oC/W) per JESD51-8S
PD = power dissipation in the package (W)
When the heat loss from the package case to the air does not factor into the calculation, an acceptable value for the junction
temperature is predictable. Ensure the application board is similar to the thermal test condition, with the component soldered to
a board with internal planes.
7 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
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