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参数资料
型号： TMX20F2810PBKAEP
厂商： Texas Instruments, Inc.
元件分类： 数字信号处理
英文描述： Digital Signal Processors
中文描述： 数字信号处理器
文件页数： 158/159页
文件大小： 2084K
代理商： TMX20F2810PBKAEP
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
BGA
LQFP
BGA
BGA
LQFP
Package
Drawing
GHH
PGF
GHH
GHH
PGF
Pins Package
Qty
189
40
189
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SM320F2812GHHMEP
SM320F2812PGFMEP
V62/05601-03XA
V62/05601-03XE
V62/05601-03ZE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
179
176
179
179
176
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Level-3-220C-168 HR
Level-2-220C-1YR
Level-3-220C-168 HR
Call TI
Level-2-220C-1YR
40
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
for the latest availability information and additional product content details.
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
29-Aug-2005
Addendum-Page 1
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