参数资料
型号: YF80532KC0412M
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 2000 MHz, MICROPROCESSOR, CPGA603
封装: MICRO, PGA-603
文件页数: 101/129页
文件大小: 1528K
代理商: YF80532KC0412M
Datasheet
73
Thermal Specifications
5.2
Measurements for Thermal Specifications
5.2.1
Processor Case Temperature Measurement
The minimum and maximum case temperatures (TCASE) for processors are specified in Table 33 of
the previous section. These temperature specifications are meant to ensure correct and reliable
operation of the processor. Figure 40 illustrates the thermal measurement point for TCASE. The
42.5 mm package measurement location applies to the Intel Xeon processor MP on the 0.13 micron
process processor, the 35 mm package measurement location applies to the Intel Xeon processor in
INT-mPGA package, and the 31 mm measurement location applies to the Intel Xeon processor in
the FC-mPGA2 package. For information on performing Tcase measurements for thermal solution
design and validation, refer to the Intel Xeon Processor (MP) Thermal Design Guidelines.
NOTE: Figure is not to scale, and is for reference only
Figure 40. Thermal Measurement Point for Processor TCASE
22.86 mm [0.90 in]
26.67 mm [1.05 in]
Measure T
CASE at this point
(geometric center of IHS)
Measure from edge of processor interposer
Thermal grease should cover
entire area of IHS
Intel Xeon MP Processor with up to 2-MB L3 Cache
(53.34 mm x 53.34 mm interposer)
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