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参数资料
型号： YF80532KC0412M
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 2000 MHz, MICROPROCESSOR, CPGA603
封装： MICRO, PGA-603
文件页数： 86/129页
文件大小： 1528K
代理商： YF80532KC0412M
Contents
6
Datasheet
31
Intel Xeon Processor MP on the 0.13 Micron Process Processor and
Intel Xeon Processor with 512-KB L2 Cache in INT-mPGA Package -
Processor Pin Details.......................................................................................... 62
32
Intel Xeon Processor MP on the 0.13 Micron Process Processor
Package IHS Flatness and Tilt Drawing.............................................................. 63
33
Intel Xeon Processor MP on the 0.13 Micron Process INT-mPGA
Package IHS Flatness and Tilt Drawing.............................................................. 63
34
Intel Xeon Processor MP on the 0.13 Micron Process Processor
Top-Side Markings (Package Example).............................................................. 65
35
Intel Xeon Processor MP on the 0.13 Micron Process Processor
Bottom-Side Markings (Package Example) ........................................................ 66
36
Intel Xeon Processor MP on the 0.13 Micron Process Processor and
Intel Xeon Processor with 512-KB L2 Cache in INT-mPGA Package -
Pinout Diagram - Top View ................................................................................. 67
37
Intel Xeon Processor MP on the 0.13 Micron Process Processor and
Intel Xeon Processor with 512-KB L2 Cache in INT-mPGA Package -
Pinout Diagram - Bottom View ............................................................................ 68
38
Thermal and Mechanical Components - Exploded View .................................... 70
39
Intel Xeon Processor MP on the 0.13 Micron Process Processor
Thermal Design Power vs. Electrical Projections................................................ 72
40
Thermal Measurement Point for Processor TCASE ........................................... 73
41
Stop Clock State Machine................................................................................... 76
42
Logical Schematic of SMBus Circuitry ................................................................ 80
43
Mechanical Representation of the Boxed Intel Xeon Processor MP
on the 0.13 Micron Process Processor Passive Heatsink................................... 91
44
Boxed Processor Clip.......................................................................................... 93
45
Boxed Processor Retention Mechanism ............................................................. 93
46
Multiple View Space Requirements for Boxed Processors ................................. 94
Tables
1
Feature Table for Intel Xeon Processor MP on the 0.13 Micron Process ..... 12
2
Core Frequency to System Bus Multiplier Configuration .................................... 17
3
System Bus Clock Frequency Select Truth Table for BSEL[1:0] ........................ 18
4
Voltage Identification Definition........................................................................... 21
5
System Bus Signal Groups ................................................................................. 23
6
Processor Absolute Maximum Ratings ............................................................... 24
7
Voltage and Current Specifications..................................................................... 25
8
System Bus Differential BCLK DC Specifications ............................................... 27
9
AGTL+ Signal Group DC Specifications ............................................................. 28
10
PWRGOOD and TAP Signal Group DC Specifications ...................................... 28
11
Asynchronous GTL+ Signal Group DC Specifications ........................................ 29
12
SMBus Signal Group DC Specifications ............................................................. 29
13
BSEL[1:0] and VID[4:0] DC Specifications.......................................................... 30
14
AGTL+ Bus Voltage Definitions........................................................................... 31
15
System Bus Differential Clock AC Specifications............................................... 32
16
System Bus Common Clock AC Specifications .................................................. 32
17
System Bus Source Synchronous AC Specifications ......................................... 33
18
Miscellaneous Signals AC Specifications ........................................................... 34
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