参数资料
型号: YF80532KC0412M
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 2000 MHz, MICROPROCESSOR, CPGA603
封装: MICRO, PGA-603
文件页数: 88/129页
文件大小: 1528K
代理商: YF80532KC0412M
Datasheet
61
Mechanical Specifications
Figure 30 details the keep in specification for pin-side components. The Intel Xeon processor MP
on the 0.13 micron process processor may contain pin side capacitors mounted to the processor
INT-mPGA package. The capacitors will be exposed within the opening of the interposer cavity.
This keep-out specification applies to the Intel Xeon processor MP on the 0.13 micron process
processor and the Intel Xeon processor in INT-mPGA package.
Figure 29. Intel Xeon Processor MP on the 0.13 Micron Process Processor Top View -
Component Keep-In
Figure 30. Intel Xeon Processor MP on the 0.13 Micron Process Processor and Intel
Xeon Processor with 512-KB L2 Cache in INT-mPGA Package - Cross Section
View - Pin Side Component Keep-In
1.270mm
IHS
FCBGA
Interposer
13.411mm
Component Keepin
Component
Keepin
Socket must allow clearance
for pin shoulders and mate
flush with this surface
1.270mm
IHS
FCBGA
Interposer
13.411mm
Component Keepin
Component
Keepin
Socket must allow clearance
for pin shoulders and mate
flush with this surface
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