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参数资料
| 型号： | YF80532KC0412M |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 2000 MHz, MICROPROCESSOR, CPGA603 |
| 封装： | MICRO, PGA-603 |
| 文件页数： | 107/129页 |
| 文件大小： | 1528K |
| 代理商： | YF80532KC0412M |
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Datasheet
79
Features
The TCC may also be activated via on-demand mode. If bit 4 of the ACPI Thermal Monitor
Control Register is written to a “1” the TCC will be activated immediately, independent of the
processor temperature. When using on-demand mode to activate the TCC, the duty cycle of the
clock modulation is programmable via bits 3:1 of the same ACPI Thermal Monitor Control
Register. In automatic mode, the duty cycle is fixed anywhere within a range of 30% to 50%;
however in on-demand mode, the duty cycle can be programmed from 12.5% on/ 87.5% off, to
87.5% on/12.5% off in 12.5% increments. On-demand mode may be used at the same time
automatic mode is enabled, however, if you try to enable the TCC via On-Demand mode at the
same time automatic mode is enabled AND a high temperature condition exists, the fixed duty
cycle of the automatic mode will override the duty cycle selected by the on-demand mode.
An external signal, PROCHOT# (processor hot), is always asserted when the processor die
temperature has reached its thermal limit. If the TCC is enabled (note that the TCC must be enabled
for the processor to be operating within spec), TCC will be active when PROCHOT# signal is
active. The temperature at which the thermal control circuit activates is not user configurable and is
not software visible. Bus snooping and interrupt latching are also active while the TCC is active.
Besides the thermal sensor and thermal control circuit, the Thermal Monitor feature also includes
one ACPI register, one performance counter register, three model specific registers (MSR), and one
output pin (PROCHOT#). All are available to monitor and control the state of the Thermal Monitor
feature. Thermal Monitor can be configured to generate an interrupt upon the assertion or de-
assertion of PROCHOT# (i.e. upon the activation/deactivation of TCC).
I
f automatic mode is disabled the processor will be operating out of specification and cannot
be guaranteed to provide reliable results. Regardless of enabling of the automatic or On-
Demand modes, in the event of a catastrophic cooling failure, the processor will automatically shut
down when the silicon has reached a temperature of approximately 135 °C. At this point the system
bus signal THERMTRIP# will go active and stay active until the processor has cooled down and
RESET# has been initiated. THERMTRIP# activation is independent of processor activity and
does not generate any bus cycles.If THERMTRIP# is asserted, processor core voltage (Vcc) must
be removed within the time frame defined in Table 18 and Figure 15.
6.3.1
Thermal Diode
The Intel Xeon processor MP on the 0.13 micron process processor incorporates an on-die thermal
diode. This thermal diode is separate from the Thermal Monitor’s thermal sensor and cannot be
used to predict the behavior of the Thermal Monitor. See Section 6.4.4 for details.
6.4
System Management Bus (SMBus) Interface
The
Intel Xeon processor MP on the 0.13 micron process processor in the INT-mPGA package
includes an SMBus interface which allows access to a memory component with two sections
(referred to as the Processor Information ROM and the Scratch EPROM) and a thermal sensor on
the substrate. The SMBus thermal sensor may be used to read the thermal diode mentioned in
Section 6.3.1. These devices and their features are described below. See Section 4 for the physical
location of these devices.
The SMBus thermal sensor and its associated thermal diode are not related to, and are completely
independent of, the precision on-die temperature sensor and thermal control circuit (TCC) of the
Thermal Monitor feature discussed in Section 6.3.
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