参数资料
型号: YF80532KC0412M
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 2000 MHz, MICROPROCESSOR, CPGA603
封装: MICRO, PGA-603
文件页数: 106/129页
文件大小: 1528K
代理商: YF80532KC0412M
78
Datasheet
Features
If RESET# is driven active while the processor is in the Sleep state, and held active as specified in
the RESET# pin specification, then the processor will reset itself, ignoring the transition through
Stop-Grant state. If RESET# is driven active while the processor is in the Sleep state, the SLP# and
STPCLK# signals should be deasserted immediately after RESET# is asserted to ensure the
processor correctly executes the reset sequence.
Once in the Sleep state, the SLP# pin can be deasserted if another asynchronous system bus event
occurs. The SLP# pin should only be asserted when the processor is in the Stop-Grant state. For
Intel Xeon processor MP on the 0.13 micron process processors, the SLP# pin may only be
asserted when all logical processors are in the Stop-Grant state. SLP# assertions while the
processors are not in the Stop-Grant state is out of specification and may result in illegal operation.
6.2.6
Bus Response during Low Power States
While in AutoHALT Power Down and Stop-Grant states, the processor will process a system bus
snoop.
When the processor is in Sleep state, the processor will not process interrupts or snoop
transactions.
6.3
Thermal Monitor
Thermal Monitor is a feature of the Intel Xeon processor MP on the 0.13 micron process processor
which allows system designers to lower the cost of thermal solutions, without compromising
system integrity or reliability. By using a factory-tuned, precision on-die temperature sensor, and a
fast acting thermal control circuit (TCC), the processor, without the aid of any additional software
or hardware, can control the processors’ die temperature within factory specifications under typical
real-world operating conditions. Thermal Monitor thus allows the processor and system thermal
solutions to be designed much closer to the power envelopes of real applications, instead of being
designed to the much higher maximum processor power envelopes.
Thermal Monitor controls the processor temperature by modulating (starting and stopping) the
internal processor core clocks. The processor clocks are modulated when the thermal control
circuit (TCC) is activated. Thermal Monitor uses two modes to activate the TCC: automatic mode
and on-Demand mode.
Automatic mode must be enabled via BIOS, which is required for the
processor to operate within specifications. Once automatic mode is enabled, the TCC will
activate only when the internal die temperature is very near the temperature limits of the processor.
When the TCC is enabled, and a high temperature situation exists (i.e., TCC is active), the clocks
will be modulated by maintaining a duty cycle within a range of 30% - 50%. Clocks will not be off
or on more than 3.0 s when the TCC is active. Cycle times are processor speed dependent and will
decrease as processor core frequencies increase. A small amount of hysteresis has been included to
prevent rapid active/inactive transitions of the TCC when the processor temperature is near the trip
point. Once the temperature has returned to a non-critical level, and the hysteresis timer has
expired, modulation ceases and the TCC goes inactive. Processor performance will be decreased
by ~50% when the TCC is active (assuming a duty cycle that varies from 30%-50%), however,
with a properly designed and characterized thermal solution the TCC most likely will only be
activated briefly during the most power intensive applications.
For automatic mode, the duty cycle is factory configured and cannot be modified. Also, automatic
mode does not require any additional hardware, software drivers or interrupt handling routines.
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