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参数资料
型号： ZL50114GAG
厂商： XILINX INC
元件分类： 通信及网络
英文描述： SPECIALTY TELECOM CIRCUIT, PBGA552
封装： 35 X 35 MM, 1.27 MM PITCH, PLASTIC, MS-034, BGA-552
文件页数： 24/113页
文件大小： 2004K
代理商： ZL50114GAG
ZL50110/11/12/14
Data Sheet
18
Zarlink Semiconductor Inc.
ZL50114 Package view from TOP side. Note that ball A1 is non-chamfered corner.
Figure 5 - ZL50114 Package View and Ball Positions
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
GND
TDM_STo
[1]
TDM_CL
Ko[3]
N/C
GND
N/C
GND
1 2
3 4 5 6
7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
TDM_FR
Mo_REF
TDM_STo
[0]
TDM_STi[
2]
TDM_CL
Ki[3]
N/C
TDM_CL
KiP
TDM_FR
Mi_REF
TDM_CL
Ki_REF
TDM_CL
Ko[1]
TDM_STi[
3]
TDM_CL
Ko[2]
N/C
RAM_DA
TA[3]
RAM_DA
TA[1]
TDM_CL
KiS
RAM_DA
TA[0]
TDM_STi[
0]
TDM_CL
Ki[1]
TDM_STo
[3]
N/C
RAM_DA
TA[10]
RAM_DA
TA[9]
RAM_DA
TA[5]
RAM_DA
TA[4]
RAM_DA
TA[2]
TDM_CL
Ko_REF
TDM_CL
Ki[0]
N/C
TDM_STi[
1]
N/C
GND
N/C
RAM_DA
TA[15]
RAM_DA
TA[13]
RAM_DA
TA[12]
RAM_DA
TA[6]
RAM_DA
TA[7]
GND
VDD_CO
RE
TDM_STo
[2]
TDM_CL
Ko[0]
TDM_CL
Ki[2]
N/C
VDD_CO
RE
N/C
VDD_CO
RE
GND
N/C
RAM_DA
TA[21]
RAM_DA
TA[18]
RAM_DA
TA[16]
RAM_DA
TA[14]
RAM_DA
TA[11]
RAM_DA
TA[8]
N/C
M1_LINK
UP_LED
M0_LINK
UP_LED
M1_GIGA
BIT_LED
M_MDIO
RAM_DA
TA[25]
RAM_DA
TA[24]
RAM_DA
TA[23]
RAM_DA
TA[19]
RAM_DA
TA[17]
VDD_CO
RE
VDD_CO
RE
M0_GIGA
BIT_LED
M_MDC
N/C
RAM_DA
TA[29]
RAM_DA
TA[28]
RAM_DA
TA[27]
RAM_DA
TA[26]
RAM_DA
TA[22]
RAM_DA
TA[20]
VDD_IO
VDD_IO VDD_IO
VDD_IO
N/C
RAM_PA
RITY[1]
RAM_PA
RITY[0]
RAM_DA
TA[31]
RAM_DA
TA[30]
GND
VDD_CO
RE
VDD_IO
VDD_CO
RE
GND
N/C
RAM_PA
RITY[7]
RAM_PA
RITY[6]
RAM_PA
RITY[5]
RAM_PA
RITY[4]
RAM_PA
RITY[3]
RAM_PA
RITY[2]
VDD_IO
GND
VDD_IO
M1_RXE
R
M1_TXCL
K
M1_CRS
N/C
RAM_AD
DR[5]
RAM_AD
DR[4]
RAM_AD
DR[2]
RAM_AD
DR[3]
RAM_AD
DR[0]
RAM_AD
DR[1]
VDD_IO
GND
VDD_IO
VDD_CO
RE
M1_REF
CLK
M1_RXCL
K
M1_RXD[
5]
M1_RXD[
7]
M1_RXD
V
GND
RAM_AD
DR[6]
RAM_AD
DR[7]
RAM_AD
DR[8]
GND
VDD_CO
RE
VDD_IO
GND
VDD_IO
M1_GTX_
CLK
GND
M1_TXER M1_RXD[
2]
M1_RXD[
3]
GND
RAM_AD
DR[9]
RAM_AD
DR[10]
RAM_AD
DR[11]
RAM_AD
DR[13]
RAM_AD
DR[16]
GND
VDD_IO
GND
VDD_IO
M1_TXD[
2]
M1_TXD[
6]
M1_TXEN
GND
M1_RXD[
4]
M1_RXD[
6]
RAM_AD
DR[12]
RAM_AD
DR[14]
RAM_AD
DR[15]
RAM_AD
DR[19]
IC_GND
IC
VDD_IO
GND
VDD_IO
M1_TXD[
0]
M1_TXD[
3]
M1_TXD[
5]
M1_TXD[
7]
M1_COL M1_RXD[
1]
RAM_AD
DR[17]
RAM_AD
DR[18]
RAM_BW
_B
IC_GND
GND
A1VDD
VDD_IO
GND
VDD_IO
VDD_CO
RE
M1_TXD[
1]
M1_TXD[
4]
GND
M1_RBC1 M1_RXD[
0]
PLL_PRI RAM_BW
_A
RAM_BW
_C
RAM_RW SYSTEM
_DEBUG
SYSTEM
_CLK
VDD_IO
M0_GTX_
CLK
M0_RXD[
2]
M0_RXD[
5]
M0_TXCL
K
M0_CRS M1_RBC0
PLL_SEC RAM_BW
_D
RAM_BW
_F
SYSTEM
_RST
GPIO[2] VDD_CO
RE
VDD_IO
VDD_IO VDD_IO
VDD_IO
M0_TXD[
7]
M0_TXERM0_TXEN M0_RXD[
4]
M0_RXD
V
M0_RXE
R
RAM_BW
_E
RAM_BW
_G
GPIO[0]
GPIO[3]
GPIO[9] RAM_DA
TA[33]
M0_TXD[
2]
M0_TXD[
5]
M0_TXD[
6]
M0_RXD[
6]
M0_RXD[
7]
M0_RXD[
3]
RAM_BW
_H
GPIO[4]
GPIO[6] GPIO[10] RAM_DA
TA[32]
VDD_CO
RE
VDD_CO
RE
M0_TXD[
1]
M0_TXD[
4]
M0_RBC0 M0_COL M0_RXD[
1]
GPIO[1]
GPIO[7]
GPIO[8] GPIO[15] RAM_DA
TA[39]
GND
RAM_DA
TA[45]
RAM_DA
TA[52]
VDD_CO
RE
JTAG_TM
S
CPU_AD
DR[2]
CPU_AD
DR[12]
VDD_CO
RE
VDD_CO
RE
CPU_DAT
A[8]
CPU_DAT
A[15]
CPU_DAT
A[23]
VDD_CO
RE
N/C
GND
M0_TXD[
0]
M0_TXD[
3]
M0_REF
CLK
M0_RBC1 M0_RXD[
0]
GPIO[5] GPIO[11] GPIO[14] RAM_DA
TA[38]
RAM_DA
TA[43]
RAM_DA
TA[44]
RAM_DA
TA[51]
RAM_DA
TA[60]
TEST_M
ODE[1]
GND
CPU_AD
DR[6]
CPU_AD
DR[14]
CPU_AD
DR[23]
CPU_TA CPU_DAT
A[1]
CPU_DAT
A[7]
CPU_DAT
A[12]
CPU_DAT
A[22]
CPU_DAT
A[30]
N/C
M0_RXCL
K
N/C
M1_ACTI
VE_LED
N/C
GPIO[12] GPIO[13] RAM_DA
TA[37]
RAM_DA
TA[42]
RAM_DA
TA[46]
RAM_DA
TA[49]
RAM_DA
TA[59]
TEST_M
ODE[0]
JTAG_TD
O
CPU_AD
DR[4]
CPU_AD
DR[9]
CPU_AD
DR[16]
CPU_AD
DR[22]
CPU_CLK CPU_DR
EQ0
IC
CPU_DAT
A[10]
CPU_DAT
A[16]
CPU_DAT
A[21]
CPU_DAT
A[27]
N/C
M0_ACTI
VE_LED
RAM_DA
TA[34]
RAM_DA
TA[36]
RAM_DA
TA[41]
RAM_DA
TA[47]
RAM_DA
TA[53]
RAM_DA
TA[58]
RAM_DA
TA[63]
JTAG_TC
K
IC_GND CPU_AD
DR[7]
CPU_AD
DR[11]
CPU_AD
DR[17]
CPU_AD
DR[21]
CPU_WE CPU_SD
ACK2
CPU_IRE
Q1
CPU_DAT
A[3]
CPU_DAT
A[6]
CPU_DAT
A[14]
CPU_DAT
A[20]
CPU_DAT
A[24]
CPU_DAT
A[29]
N/C
RAM_DA
TA[35]
RAM_DA
TA[40]
RAM_DA
TA[48]
RAM_DA
TA[54]
RAM_DA
TA[57]
RAM_DA
TA[62]
JTAG_TR
ST
IC_GND CPU_AD
DR[3]
CPU_AD
DR[8]
CPU_AD
DR[13]
CPU_AD
DR[18]
CPU_AD
DR[20]
CPU_OE CPU_TS_
ALE
CPU_DR
EQ1
IC
CPU_DAT
A[4]
CPU_DAT
A[9]
CPU_DAT
A[13]
CPU_DAT
A[18]
CPU_DAT
A[25]
CPU_DAT
A[28]
N/C
GND
RAM_DA
TA[50]
RAM_DA
TA[55]
RAM_DA
TA[56]
RAM_DA
TA[61]
TEST_M
ODE[2]
JTAG_TDI IC_GND CPU_AD
DR[5]
CPU_AD
DR[10]
CPU_AD
DR[15]
CPU_AD
DR[19]
GND
CPU_CS CPU_SD
ACK1
IC_VDD_I
O
CPU_IRE
Q0
CPU_DAT
A[0]
CPU_DAT
A[5]
CPU_DAT
A[2]
CPU_DAT
A[11]
CPU_DAT
A[17]
CPU_DAT
A[19]
CPU_DAT
A[26]
CPU_DAT
A[31]
GND
1 2
3 4 5 6
7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
VDD_CO
RE
VDD_IO
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相关代理商/技术参数
参数描述
ZL50114GAG2 制造商:Microsemi Corporation 功能描述:CESOP PROCESSOR 552BGA - Trays 制造商:MICROSEMI CONSUMER MEDICAL PRODUCT GROUP 功能描述:IC CESOP PROCESSOR 128CH 552PBGA 制造商:Microsemi Corporation 功能描述:IC CESOP PROCESSOR 128CH 552PBGA
ZL50115 制造商:ZARLINK 制造商全称:Zarlink Semiconductor Inc 功能描述:32, 64 and 128 Channel CESoP Processors
ZL50115GAG 制造商:Microsemi Corporation 功能描述:SWIT FABRIC 1K X 1K 1.8V/3.3V 324BGA - Trays 制造商:Microsemi Corporation 功能描述:IC CESOP PROCESSOR 32CH 324PBGA
ZL50115GAG2 制造商:Microsemi Corporation 功能描述:PB FREE 1 TDM + 1 ETHERNET - Trays 制造商:Microsemi Corporation 功能描述:IC CESOP PROCESSOR 32CH 324PBGA
ZL50116 制造商:ZARLINK 制造商全称:Zarlink Semiconductor Inc 功能描述:32, 64 and 128 Channel CESoP Processors
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