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参数资料
| 型号： | ZL50114GAG |
| 厂商： | XILINX INC |
| 元件分类： | 通信及网络 |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, PBGA552 |
| 封装： | 35 X 35 MM, 1.27 MM PITCH, PLASTIC, MS-034, BGA-552 |
| 文件页数： | 61/113页 |
| 文件大小： | 2004K |
| 代理商： | ZL50114GAG |
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ZL50110/11/12/14
Data Sheet
51
Zarlink Semiconductor Inc.
3.10
ZL50111, ZL50112, ZL50110 and ZA50114 Internal Connections
3.11
ZL50112 Internal Connections
3.12
ZL50112 Auxiliary Clocks
4.0
Typical Applications
4.1
Leased Line Provision
Circuit emulation is typically used to support the provision of leased line services to customers using legacy TDM
equipment. For example, Figure 6 shows a leased line TDM service being carried across a packet network. The
advantages are that a carrier can upgrade to a packet switched network, whilst still maintaining their existing TDM
business.
Signal
Package Balls
Description
IC
R6, AC16, AE17
Internally Connected. Must leave open
circuit.
Table 21 - No Connection Ball Definition
Signal
Package Balls
Description
IC
G21, F25, E26. G22
Internally Connected. Must leave open
circuit.
Table 22 - No Connection Ball Definition
Signal
Package Balls
Description
AUX2_CLKo[1:0]
C17, C15
Auxiliary clock output. Typically
AUX2_CLKo[1] is connected to
AUX2_CLKi[1] and AUX2_CLKo[0] is
connected to AUX2_CLKi[0] through a
zero ohm resistor.
AUX2_CLKi[1:0]
E15, D15
Auxiliary clock input. Typically
AUX2_CLKi[1] is connected to
AUX2_CLKo[1] and AUX2_CLKi[0] is
connected to AUX2_CLKo[0] through a
zero ohm resistor.
AUX1_CLKo[1:0]
D16, A18
Auxiliary clock output. Typically
AUX1_CLKo[1] is connected to
AUX1_CLKi[1] and AUX1_CLKo[0] is
connected to AUX1_CLKi[0]
AUX1_CLKi[1:0]
E16, B18
Auxiliary clock input. Typically
AUX1_CLKi[1] is connected to
AUX1_CLKo[1] and AUX1_CLKi[0] is
connected to AUX1_CLKo[0]
Table 23 - Auxiliary clock Ball Definition
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ZL50114GAG2 | 制造商:Microsemi Corporation 功能描述:CESOP PROCESSOR 552BGA - Trays 制造商:MICROSEMI CONSUMER MEDICAL PRODUCT GROUP 功能描述:IC CESOP PROCESSOR 128CH 552PBGA 制造商:Microsemi Corporation 功能描述:IC CESOP PROCESSOR 128CH 552PBGA |
| ZL50115 | 制造商:ZARLINK 制造商全称:Zarlink Semiconductor Inc 功能描述:32, 64 and 128 Channel CESoP Processors |
| ZL50115GAG | 制造商:Microsemi Corporation 功能描述:SWIT FABRIC 1K X 1K 1.8V/3.3V 324BGA - Trays 制造商:Microsemi Corporation 功能描述:IC CESOP PROCESSOR 32CH 324PBGA |
| ZL50115GAG2 | 制造商:Microsemi Corporation 功能描述:PB FREE 1 TDM + 1 ETHERNET - Trays 制造商:Microsemi Corporation 功能描述:IC CESOP PROCESSOR 32CH 324PBGA |
| ZL50116 | 制造商:ZARLINK 制造商全称:Zarlink Semiconductor Inc 功能描述:32, 64 and 128 Channel CESoP Processors |
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