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参数资料
| 型号： | K4T56163QI-ZLD50 |
| 元件分类： | DRAM |
| 英文描述： | 16M X 16 SYNCHRONOUS DRAM, 0.5 ns, PBGA84 |
| 封装： | ROHS COMPLIANT, FBGA-84 |
| 文件页数： | 6/42页 |
| 文件大小： | 727K |
| 代理商： | K4T56163QI-ZLD50 |
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Rev. 1.0 October 2007
DDR2 SDRAM
K4T56163QI
14 of 42
Note :
1. IDD specifications are tested after the device is properly initialized
2. Input slew rate is specified by AC Parametric Test Condition
3. IDD parameters are specified with ODT disabled.
4. Data bus consists of DQ, DM, DQS, DQS\, RDQS, RDQS\, LDQS, LDQS\, UDQS, and UDQS\. IDD values must be met with all combinations of EMRS
bits 10 and 11.
5. Definitions for IDD
LOW is defined as Vin
≤ VILAC(max)
HIGH is defined as Vin
≥ VIHAC(min)
STABLE is defined as inputs stable at a HIGH or LOW level
FLOATING is defined as inputs at VREF = VDDQ/2
SWITCHING is defined as:
inputs changing between HIGH and LOW every other clock cycle (once per two clocks) for address and control
signals, and
inputs changing between HIGH and LOW every other data transfer (once per clock) for DQ signals not including
masks or strobes.
For purposes of IDD testing, the following parameters are utilized
Detailed IDD7
The detailed timings are shown below for IDD7.
Legend: A = Active; RA = Read with Autoprecharge; D = Deselect
IDD7: Operating Current: All Bank Interleave Read operation
All banks are being interleaved at minimum tRC(IDD) without violating tRRD(IDD) and tFAW(IDD) using a burst length of 4. Control and address bus
inputs are STABLE during DESELECTs. IOUT = 0mA
Timing Patterns for 4 bank devices x16
-DDR2-400 3/3/3
A0 RA0 A1 RA1 A2 RA2 A3 RA3 D D D
-DDR2-533 4/4/4
A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D D D
-DDR2-667 5/5/5
A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D D
-DDR2-800 6/6/6
A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D D D D D D
-DDR2-800 5/5/5
A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D D D D D
DDR2-800
DDR2-667
DDR2-533
DDR2-400
Units
Parameter
5-5-5
6-6-6
5-5-5
4-4-4
3-3-3
CL(IDD)
5
6
5
4
3
tCK
tRCD(IDD)
12.5
15
ns
tRC(IDD)
57.5
60
55
ns
tRRD(IDD)-x16
7.5
ns
tCK(IDD)
2.5
3
3.75
5
ns
tRASmin(IDD)
45
40
ns
tRP(IDD)
12.5
15
ns
tRFC(IDD)
105
ns
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相关代理商/技术参数 |
参数描述 |
|---|---|
| K4T56163QN | 制造商:SAMSUNG 制造商全称:Samsung semiconductor 功能描述:Consumer Memory |
| K4T56163QN-HCE6000 | 制造商:Samsung SDI 功能描述:DRAM Chip DDR2 SDRAM 256M-Bit 16Mx16 1.8V 84-Pin FBGA Tray |
| K4T56163QN-HCE6T00 | 制造商:Samsung SDI 功能描述: |
| K4T56163QN-ZCE6T00 | 制造商:Samsung 功能描述:256 SDRAM X16 - Tape and Reel |
| K4T56163QN-ZCE7000 | 制造商:Samsung 功能描述:DDR2 SDRAM 32MX16 47H32M16 PBF FBGA 1.8V PLASTIC 512M - Trays |
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